The 3-D Architectures for Semiconductor Integration and Packaging Conference will take place December 9-11, 2009, at the Hyatt Regency San Francisco Airport in Burlingame, CA. This year’s conference will provide attendees and speakers the unique opportunity to explore and understand the technology and business implications of the trend toward 3-D device and system integration in the semiconductor industry. At the conference, Si2 will present the findings from a recent 3D Standards workshop hosted by Si2 and GSA.
3D Architectures for Semiconductor Integration and Packaging Conference
- The IDM and Foundry Perspective on 3-D Technology Trends and Opportunities
- The Packaging Foundry and its Vital Role in Driving 3-D
- Looking Over the Horizon – Forecasting Growth
- On the Front – Applications Driving 3-D Development and Commercialization
- Taking Advantage of 3-D – Rethinking Design Approaches
- Industry and Government Funded 3-D Efforts – Key Research Outcomes and Resources
- Fundamental Technology Approaches to Building 3-D
- Wafer Handling Leads the Way on Manufacturing
The various performance, size, and cost drivers to the move toward 3-D are well known. Likewise, the various routes and options for implementation of 3-D, whether it is through front-end device manufacturing or in back-end packaging, are often discussed. Near-term market opportunities are widely recognized as well. Regardless of this expanding reality, the situation continues to be very dynamic as technology continues to evolve, and the understanding of cost/performance benefits relative to specific market applications continues to expand. The best path forward, whether from a technology or market standpoint, often remains uncertain.