Terepac and IMEC Team on Flexible Electronics Packaging

Terepac teamed with IMEC to develop packaging technologies for flexible electronics. The initial driver for the synergistic shared research relationship is a next generation wireless ECG system, developed in the Human++ Program at Holst Centre, Eindhoven. The patented photochemical printing process, thinned silicon dies, and passive components can be placed on flexible substrates at speeds of more than one chip per second and with accuracies down to a few microns.

As electronic systems will become ubiquitous, the demand for innovative packaging technologies increases. For many applications, like on-the-body devices, thin and flexible form factors greatly improve the comfort of the wearer. In order to allow large-scale manufacturing and market penetration, low-cost yet high value solutions are key. Traditional electronics packaging and assembly with rigid printed circuit boards and pick-and-place machines are unable to cope with these demands.

The system developed by Terepac can transfer printing electronic components of any lateral size and thinness down to microns or below, at high speeds and accuracy. With costs far below any competing technique and no sacrifice in performance, this platform technology introduces revolutionary advances in assembly and packaging of micro and nanoelectronics. Ubiquitously deployed real time location systems, wireless sensors, RFID tags, and embedded electronics products will provide the input to a Microelectronic Nervous System (MNS), a Terepac-enabled network which reports not only an object’s location but also its condition, creating a uniquely powerful tool for economic competitiveness, quality of life and sustainability.

More info: IMEC | Holst Centre | Terepac