ESH Challenges for the Next Generation Fabs

The 2009 ISMI Symposium on Manufacturing Effectiveness will feature a panel of environment, safety, and health experts. The 6th annual conference will held on October 19-22, 2009 at the Hilton Austin Airport. The panel discussion, entitled “ESH Challenges for the Next Generation Fabs,” will provide attendees with forward-looking ideas on leading-edge technologies that protect the environment, as well as more effective processes for lowering the costs of chip manufacturing.

The panel will be held during the ESH Solutions session on Wednesday, October 21, at 2:45 p.m. Panelists will present a short overview of their perspective on key ESH challenges for the next generation of fabs.

Expert Panelists

  • Arthur Chuang, Director of New Fab Planning and Engineering Division, TSMC
  • Tim Higgs, Environmental Engineer, Intel
  • Bruce Klafter, Director, Global EHS, Applied Materials
  • Aaron Zude, Senior EHS Director, SEMI

As semiconductor processes and products become increasingly complex, so do EHS challenges. Larger fabs with greater resource demands, the use of exotic materials, and increasingly more complex regulatory constraints are some of the key challenges that drive the need for EHS professionals to continuously share information and advance their skills. The key is very early engagement with universities and consortia, and across the supply chain, to assess new materials, develop optimum material handling procedures, and find new ways to conserve resources.

More info: ISMI Manufacturing Week