2009 Asia Symposium on Quality Electronic Design
The 2009 Asia Symposium on Quality Electronic Design (ASQED09) will take place July 15-16, 2009 in Kuala Lumpur, Malaysia. The program consists of keynote speeches from Synopsys, NXP, Cadence Design Systems, University of Tokyo, and Verdant Electronics. The event also features tutorials, panel discussion, and over 80 technical presentations. Techanical papers will be presented in three parallel tracks on Wednesday July 15th and Thursday July 16th.
Technical Sessions Topics
- Circuit and System Design
- Test and Verification
- IC Packaging Technology
- PCB and PWB Technology and Manufacturing
- Semiconductor Technology and Manufacturing
- Nano and Bio Electronics Innovations
- Photovoltaic Technology and Manufacturing
- Electronic Design Automation Methodologies
Keynotes, Tutorials, and Panel Discussion
-
A New World of Partnerships for 22nm and Below
Dr. Chi-Foon Chan, President and COO, Synopsys -
The Present Status and Issues in Solar Photovoltaic Systems
Professor Takashi Tomita, Solar Quest, RCAST, the University of Tokyo -
IC Packaging Technology – Electronic’s New Gatekeeper for Cost and Performance
Mr. Joseph Fjelstad, Founder and President, Verdant Electronics -
Trust But Verify – Product Quality in the SoC Era
Dr. Charlie Huang, SVP and Chief Strategy Officer, Cadence Design Systems -
Variability-Resilient Mixed-Signal IC Design Methods
Dr. Hans Rijns, Vice President, head of Research, NXP Semiconductors, Netherlands -
Tera-scale Computing and Interconnect Challenges – 3D Stacking Considerations
Dr. Tanay Karnik, Intel -
Advanced Packaging Technologies and Future Interconnection Trends
Joseph Fjelstad, Verdant Electronics -
Electronic Industry Trends and Implications for Asia
Moderated by Dr. Ali Iranmanesh, CEO and Chairman, Silicon Valley Technical Institute
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