EDA News – 2008.05.21 Late Edition

Calypto to Give Away PowerPro-filer Power Profiling Software at DAC
Calypto[tm] Design Systems Inc. will offer qualified Design Automation Conference (DAC) attendees who visit the Calypto Booth (#1354) a free copy of PowerPro-filer on a one gigabyte memory stick. The recently introduced PowerPro-filer is a Linux program that reads synthesizable Verilog code.

MSIM Spice Circuit Simulator Runs 10X Faster for Characterizing CCS Model
Legend Design Technology, Inc. announced that its MSIM, a high-accuracy Spice circuit simulator, has been upgraded for efficient characterization of CCS (Composite Current Source) model used in cell library characterization in SoC designs.

IEEE Working Group Updates 1647-2008 e Language Standard
The IEEE has approved a revision to IEEE 1647, Standard for the Functional Verification Language e. The e language was first ratified as a standard in 2006 and has historically been a powerful high-level verification language for hardware designers.

Technical Working Group Releases DDR PHY Interface Specification 2.0
Denali Software, Inc., as one of the DDR PHY Interface (DFI) specification participating members including ARM, Denali, Intel, and Samsung, announced the release of the new DFI specification version 2.0. The collaborative technical working group, which includes representatives from these companies, delivered several improvements and enhancements in this latest version of the DFI specification.

DAC 2008 Features Si2 Low Power Coalition Workshop
The Silicon Integration Initiative (Si2) announced the Low Power Coalition workshop being hosted at the Design Automation Conference (DAC) show to be held at the Anaheim Convention Center in Anaheim, CA, from June 8-13, 2008.

Six Events to Collocate with Design Automation Conference
The 45th Design Automation Conference (DAC) has coordinated with organizers of six related industry events and conferences to collocate with DAC to provide greater benefit to participants.

Advantest Rolls Out T5503 Memory Test Solution
Advantest Corporation (TSE: 6857, NYSE: ATE) announced its new T5503 high-throughput memory test system, boasting the industry’s highest parallel test capability of up to 128 devices. The T5503 was developed to address the challenges of high-volume production test of next-generation high-speed DDR3-SDRAM memory.

Express Logic Becomes Member of Eclipse Foundation
Express Logic, Inc. announced that it has joined the Eclipse Foundation, an open-source community, whose projects are focused on building an open development platform comprised of extensible frameworks, tools and runtimes for building, deploying and managing software across the lifecycle.

ADLINK Unveils ETX-NR667 Module with 64-bit Intel Core2 Duo Processor
ADLINK Technology Inc. (TAIEX: 6166) announced a new member to its ETX® family of Computers on Modules in production. The ETX-NR667 is based on the latest ETX® 3.02 form factor standard that allows two additional SATA ports to the module.

Arrow Couples Custom Chip Design with ARM Processors, IP
The North American Components business of Arrow Electronics, Inc. (NYSE:ARW) announced an extended relationship with ARM to broaden Arrow’s silicon offering by coupling its custom chip design and logistics capabilities with ARM® industry-standard processors and associated intellectual property.

ACCES I/O Products Rolls Out Model USB-IDIO-16 USB/104 I/O Modules
ACCES I/O Products announces the latest addition to its impressive line of USB/104 I/O modules – Model USB-IDIO-16. The unit features 16 individually optically isolated inputs and 16 fully protected solid state FET outputs capable of switching up to 2A each.