EDA News – 2008.05.20 Late Edition

Apache Unveils Sentinel-PI Chip Package System Co-Design, Co-Analysis
Apache Design Solutions announced Sentinel-PI, the industry’s first fully-integrated chip-package-system co-design and co-analysis solution for power integrity. Sentinel-PI provides SoC-aware modeling and analysis of the system-level power delivery network.

MIPS Hi-Fi Audio Codec IP Achieves Lowest Power Consumption
MIPS Technologies, Inc. (NasdaqGS: MIPS) announced that its Hi-Fi Audio Codec IP platform has achieved the lowest known power consumption for Hi-Fi audio playback, while reaching superior performance of 100dB dynamic range. The new CI7824sm Audio Codec sets a new standard for Hi-Fi performance at ultra low-power.

Advanced Thermal Solutions to Present Temperature Measurement Webinar
Advanced Thermal Solutions, Inc’s popular Thermal Management Webinar Series continues in May with an hour-long technical webinar, “Temperature Measurement in Electronics Design”, on Wednesday, May 28, 2008 from 2:00-3:00 p.m.

SemiSouth Laboratories to Present Normally-off SiC VJFET Paper at ISPSD
SemiSouth Laboratories Inc. will discuss the characteristics and specifications of their normally-off SiC JFET for 800V and 1200V power switching applications. SiC-based power semiconductors provide several advantages over their silicon-based counterparts.

PureDepth to Present Multi-Layer Display Paper at SID 2008
PureDepth, Inc. (OTC: PDEP) announced that Gareth Bell, Chief Scientist, will be presenting at the Society for Information Display (SID) Symposium on May 21, 2008 at 10 a.m. PDT. PureDepth’s MLD technology lends itself to a broad array of applications.

Design Automation Conference Features ACM Turing Award Winners
The 2007 ACM Turing Award Winners, Dr. Edmund M. Clarke of Carnegie Mellon University; Dr. E. Allen Emerson of the University of Texas, Austin and Dr. Joseph Sifakis of Verimag Labs, France will be guest speakers at the 45th Design Automation Conference (DAC).

ZMD to Showcase ADCs, Signal Conditioning Devices at Sensors Expo
ZMD AG will showcase analog-to-digital converters and signal conditioning devices at the Sensors Expo (www.sensorsexpo.com) on June 9 – 11. ZMD’s booth number is 820 at the Rosemont, Illinois, event. Attendees can evaluate the devices for automotive, consumer, industrial and mobile medical applications.

VDC Releases Latest Merchant ATCA CPU Blade Shipment Forecast
VDC has released the 2008 edition of its research on Slot Single Board Computers in Volume 1 of VDC’s Merchant Computer Boards for Embedded/Real-Time Applications Intelligence Program, 2008. The actual 2007 dollar volume shipments of ATCA CPU blades exceeded VDC’s previous forecast for 2007.

OKI Releases Fingerprint Authentication LSI SDK v2 for ML67Q5250
Oki Electric Industry Co., Ltd. (TOKYO:6703) announced it has released its second version Software Development Kit (SDK) for ML67Q5250, the fingerprint authentication LSI that enables match-on-device. OKI made improvements to the SDK to enable compatibility with different types of touch sensors.

Kineto Wireless, Agilent Team on 3G, 2G UMA/GAN Handset Testing
Kineto Wireless and Agilent Technologies Inc. (NYSE: A) announced the companies are collaborating on 3G and 2G UMA/GAN handset testing to bring a comprehensive solution to their customers. The companies will focus on expanding Agilent’s 8960 “real world” UMA/GAN test capabilities.