EDA News – 2008.05.19 Late Edition

DFMSim Debuts Virtual Factory Tool Suite for Semiconductor Manufacturers
DFMSim launched an innovative class of software tools that enable designers and manufacturers of complex integrated circuits (ICs) to accurately predict and avoid systemic errors that seriously impact manufacturing yields and harm their bottom lines.

802.11n WLAN DOCSIS 3.0 Gateway Reference Design with TI Puma 5
Ralink announced that its Wi-Fi 802.11n solution – RT2880 iNIC now supports Texas Instruments’ Puma 5 family of DOCSIS® 3.0-based (Data Over Cable Service Interface Specification) cable modem chipsets. TI’s Puma 5 family is a DOCSIS 3.0 compliant cable modem chipset.

Sequence Design Speeds RTL Power Reduction with PowerArtist
Sequence Design introduced PowerArtist[tm], offering the industry’s fastest automated RTL power reduction – 10 to 50 percent or more depending on the design – in just minutes on a million-plus gate block.

Cypress, UICO to Create Electronic UI for Appliance, Medical, Industrial
Cypress Semiconductor Corp. (Cypress) (NYSE:CY) announced a joint marketing agreement with UICO, LLC (UICO) enabling UICO to deliver innovative electronic user-interface (UI) solutions to the appliance, medical, and industrial markets.

Sicap, Red Bend to Provide Seamless Management of Mobile Devices
Mobile operators and device manufacturers will now have complete control over remotely managing all mobile devices in the network using a standards-based, fully interoperable solution from Sicap and Red Bend Software.

NEC Develops Technology for Complex, Non Rectangular TFT LCD Modules
NEC LCD Technologies announced the successful development of a manufacturing technology that enables more flexible design of thin-film transistor (TFT) liquid crystal display (LCD) panels. The prototype design is a heart-shaped low-temperature polysilicon (LTPS) color TFT LCD module.

Texas Instruments Rolls Out TNETC4820 Puma 5 DOCSIS 3.0 Chipset
Texas Instruments Incorporated (TI) [NYSE: TXN] announced a new DOCSIS 3.0® (Data Over Cable Service Interface Specification) product that supports cable set-top-boxes (STB) with both MPEG-TS (transport stream) and Internet Protocol (IP) capabilities.

International Rectifier Unveils MOSFETs for Power Supplies, Electric Motors
International Rectifier, IR® (NYSE: IRF) introduced a new family of 60 V and 75 V MOSFETs optimized for industrial battery applications such as E-bikes, scooters and utility carts. The new N-channel devices utilize IR’s trench MOSFET technology.

Jennic Creates LoWPAN Networking Stack for Embedded IP Communications
Jennic announces the industry’s first networking stack to enable a single-chip implementation for next-generation low-power wireless IP in embedded devices. Applications may leverage existing IP infrastructure and knowledge base, reducing development costs and time to market.

Texas Instruments Announces TPS65136 Organic LED Power Driver
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced an organic light emitting diode (OLED) power driver designed to enhance image quality for small form factor displays up to 2.5 inches.

Infineon DECT 6.0 / CAT-iq Chipset Features TI Puma 5 DOCSIS 3.0 Cable Modem
Infineon Technologies AG (FWB:IFX) (NYSE:IFX) announced a cost-effective DECT solution, which when combined with a DOCSIS 3.0 chipset, produces a platform for North American cable service providers to deploy next-generation Voice-over-IP (VoIP) services operating over DECT 6.0 cordless telephones.

Shanghai Welltech Automation Selects Ramtron FM25L16 Serial F-RAM
Ramtron International Corporation (Nasdaq: RMTR) announced that China’s Shanghai Welltech Automation Co., Ltd., a leading pressure transmitter and magnetic flow meter supplier, has designed Ramtron’s FM25L16 16-kilobit (Kb) serial F-RAM memory device into its 2000S safe pressure transmitters.