Court of Appeals for DC Circuit Overturns FTC Orders in Rambus Case
Rambus Inc. (Nasdaq:RMBS) announced that the US Court of Appeals for the DC Circuit has overturned the Federal Trade Commission’s (FTC) decisions regarding Rambus, and remanded the matter back to the FTC for further proceedings consistent with the Court’s opinion.
TSMC Announces 40/65 Nanometer SPICE Tool Qualification Program
Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) unveiled at its opening 2008 Technology Symposium a comprehensive SPICE Tool Qualification Program that drives its Design Service ecosystem partners to develop SPICE simulators with greater accuracy and higher performance.
TTM Selects Cadence SoC Encounter XL System, Litho Physical Analyzer
Cadence Design Systems, Inc. (NASDAQ: CDNS) announced that Time To Market, Inc. (TTM) was able to detect hot spots and optimize yields for a complex 65-nanometer design using a holistic design-for-manufacturability flow from Cadence that includes the SoC Encounter(tm) XL system and the Litho Physical Analyzer.
IBM Licenses Rambus Multi-Protocol SerDes
Rambus Inc. (NASDAQ:RMBS) announced that IBM has licensed Rambus’ multi-protocol SerDes (Serial/Deserializer) cell designed for advanced networking, server and general ASIC applications. This sophisticated multi-protocol SerDes cell provides IBM with a high-performance and low-power solution.
Spectrum Control Develops Dual Frequency Patch Antenna
Spectrum Control, Inc. has designed a new single element patch antenna that can receive and/or transmit two frequency bands in one 45mm package. This dual frequency patch antenna provides a space and cost savings compared to using two, single frequency patch antennas.
Agilent Releases GoldenGate 4.2 RFIC Simulation Software
Agilent Technologies Inc. (NYSE:A) announced the release of the latest version of its RFIC simulation software, GoldenGate. This release represents an expansion in RFIC simulation coverage for wireless communications products.
ChipVision Debuts PowerOpt, P-SAM ESL Power Optimization Design Tools
ChipVision Design Systems announced two breakthrough products – PowerOpt(tm) and P-SAM – that help companies meet their power budget requirements early in the design cycle. The new tools are ideal for companies developing mobile communications, networking, consumer or automotive applications.
Red Bend Software to Expand with New $10 Million Funding
Red Bend Software announced that it has secured $10 million in funding to fuel the company’s expansion into the mobile and machine-to-machine (M2M) markets. The funding was led by new investor Coral Capital Management.
MSC Vertriebs Joins Qseven Consortium
MSC Vertriebs GmbH has joined the group of founder members of the Qseven(tm) consortium, thus underlining their active support of the small form-factor 70 mm x 70 mm. The Qseven platform was developed especially with respect to highest performance capability with the most possible flexibility in the choice of processors.
PHYTEC Releases phyCORE-LPC3250 ARM9 Single Board Computer
PHYTEC announces the release of its new phyCORE®-LPC3250 Single Board Computer (SBC) subassembly. The phyCORE-LPC3250 is an ARM9 based, small form factor (70×58 mm), OEMable module populated with the NXP LPC3250 microcontroller. The LPC3250 can operate in ultra-low-power mode down to 0.9V.
Gleichmann Announces 110 Degrees C NEC PS2561B Optocoupler
Gleichmann Electronics announces immediate availability of NEC Electronics’ PS2561B high temperature optocoupler for operation at up to 110°C ambient temperature. The PS2561B device features a high isolation voltage of 5000 Viso. In addition, the optocoupler is suitable for input currents from 1mA to 5mA.
Interphase, 6WIND Team on Integrated Packet Accelerator Products
Interphase announced its partnership with 6WIND, a leader in embedded networking software. Initially this integration will be completed on the Interphase iSPAN(tm) 36CA AdvancedMC(tm) and iSPAN(tm) 55CA PCI-X Cavium Networks OCTEON(tm) packet accelerator cards.