EDA News – 2008.04.01 Late Edition

Tensilica to Make Multiple Presentations at Multicore Expo
Tensilica, Inc. is recognized as an industry leader with its low-power, benchmark-proven processor cores. The company has been selected to participate in presentations and panels at the Multicore Expo held April 1-3, 2008, in San Jose, California.

WiMAX World EMEA 2008 Conference and Expo Reveals Keynote Speakers
The WiMAX World EMEA Conference & Expo is expected to bring together over 2,000+ professionals from some of the most exciting and fastest-growing companies in the world as well as from the large and active WiMAX Forum membership community. The conference will take place May 19-21, 2008, at the ICM Munich.

Hitachi Maxell Improves Fuel Cells with New Highly-Active Catalyst
Hitachi Maxell, Ltd. (TSE: 6810) has announced development of a new catalyst used for oxygen-reduction reactions at the cathode of a polymer electrolyte fuel cell (PEFC). The new catalyst is gold-platinum (AuPt) nano-particle 2 to 3 nm in size.

Texas Instruments, IIT Kharagpur Team on Medical Technology Research
Texas Instruments Incorporated (TI) (NYSE: TXN) has signed a collaborative agreement with the School of Medical Science and Technology (SMST), Indian Institute of Technology (IIT) Kharagpur, to develop semiconductor technologies that will help improve the quality, comfort and accessibility of health care.

Sound Design Unveils VOYAGEURII Audio Processing DSP Platform
Sound Design Technologies (SDT), a designer and manufacturer of ultra-low power semiconductor solutions for hearing instruments, has launched the VOYAGEURII(tm) series of DSP solutions, consisting of programmable DSP platforms as integrated circuits or packaged hybrids and preconfigured hearing aid solutions.

Toshiba Offers Embedded Removable Memory for Mobile Handsets
Memory subsystems in mobile handsets continue to grow in capacity and complexity, driven by growing storage requirements for images, music, video, and data as more features such as audio players, megapixel cameras, streaming video, GPS, and Mobile TV are integrated into mobile phones.

GCT Creates Chip for Mobile WiMAX IEEE 802.16e WAVE 2, WiFi 802.11 b/g
GCT Semiconductor, a leading supplier of Mobile WiMAX solutions to the global market, announced the world’s first highly integrated single-chip solution, GDM7215, supporting mobile WiMAX (IEEE 802.16e WAVE 2) and WiFi (802.11b/g). GDM7215 implements mobile WiMAX RF/MAC/PHY and WiFi RF/MAC/PHY on a monolithic die.

NextWave Wireless Introduces NW2000 Wave 2-ready Mobile WiMAX Chipset
Demonstrating leadership in delivering cutting-edge WiMAX silicon to market, NextWave Wireless Inc. (NASDAQ: WAVE), a global provider of mobile multimedia and wireless broadband technologies, announced the NW2000 Wave 2-ready family of advanced, second-generation mobile WiMAX chipsets.

AXIOMTEK Rolls Out eBOX630-821-FL Compact Rugged Embedded Computer
AXIOMTEK released a fanless compact embedded computer, the eBOX630-821-FL, which features dual display ports (optional) and supports a superior socket 478 Intel® Pentium® M (up to 2.0GHz/2MB) / Celeron M (up to 1.5GHz/1MB) processor or an onboard ultra low voltage Intel Celeron M 600MHz/512KB processor.

Adeneo Releases Windows Embedded CE 6.0 BSP for NXP LH7A404 ARM9
Adeneo, a Microsoft Windows Embedded Gold Partner with facilities in Europe and in the USA, announced the full commercial release of the Windows Embedded CE 6.0 BSP for NXP Semiconductors LH7A404 ARM9(tm) processor-based microcontroller.

Motive, Red Bend Software Announce Mobile Interoperability
Motive, Inc. (OTC: MOTV) and Red Bend Software announced interoperability between the two companies’ solutions, enabling service providers to improve the profit potential of their mobile and converged service offerings.

Red Bend vCurrent Mobile Client, TI LoCosto Platform Upgrade Handsets
Red Bend Software, the market leader in Mobile Software Management, announced support for its market-leading vCurrent® Mobile client software for firmware over-the-air (FOTA) updating on Texas Instruments’ (TI) LoCosto(tm) platform for entry-range handsets.