STMicroelectronics (NYSE:STM) recently introduced its 4th-generation Bluetooth®/FM Radio combo solution, which meets the demanding integration and cost requirements of the cellular phone market. By combining Bluetooth wireless personal-area-network functionality with an FM radio transceiver in a single 65nm chip, the STLC2690 offers leading-edge integration and performance. The new chip from is manufactured in ST’s low-leakage ultra-low-power 65nm RFCMOS technology. STLC2690 samples are already being evaluated by several leading handset manufacturers and volume mass production is scheduled for the second half of 2008.
The combo solution saves space and costs for manufacturers of portable products, while delivering to consumers stereo FM R(B)DS reception (RX) direct to their Bluetooth headsets. The fully integrated short range FM R(B)DS transmitter (TX) allows users to enjoy stored music content on any in-car or home FM radio tuner and delivers increased versatility to the mobile device.
The STLC2690 is compliant with BT v2.1+EDR and further increases the field-proven class-1.5 Bluetooth output power, requiring only one supply voltage and without any calibration in production. The Bluetooth link stability is dramatically increased by also further improving the Bluetooth receiver sensitivity, while reducing the best-in-class current consumption by up to 35% compared to former generation products in 130nm technology.
The integrated FM receiver sets a new world standard for receiver sensitivity and with real-time programmable filters for optimum search and sensitivity stability, the STLC2690 can also be used with integrated FM antennas. The device supports all deployed R(B)DS services and all worldwide FM bands (65 to 108MHz).
The short-range FM transmitter is specifically designed for use in mobile phones that also take advantage of the presence of a FM receiver. Proprietary SureTune(tm) technology automatically selects the optimal FM transmit frequency, while the programmable high output power allows stable operation even when using integrated antennas with poor efficiency. The STLC2690 delivers a stable and user-friendly FM transmission implementation with real enhancement of the user experience in mobile applications.
The new STLC2690 comes in a Wafer Level Chip Scale Package (WLCSP) with a 0.4mm pitch. Its ultra-low external BOM count allows a PCB footprint as small as 36mm2. The pin-out arrangement of the STLC2690 is also suitable for use on low-cost PCB assemblies.
More info: STMicroelectronics Bluetooth ICs and Modules