Mentor Graphics Announces 2008 Integrated Electrical Solutions Forum
Mentor Graphics Corporation (Nasdaq: MENT) announced its 2008 Integrated Electrical Solutions Forum (IESF) program. IESF is a full one day event that, now in its seventh year, has become a leading forum for electrical and electronic systems design, modeling, simulation and analysis within the automotive industry.
ADLINK Technology Acquires Ampro Computer
The board of ADLINK Technology (6166 TT, “ADLINK”) adopted a resolution to acquire 100% shareholding of Ampro Computer Inc.(“Ampro”). ADLINK will acquire a total of 39,743,137 common shares in Ampro (representing 100% of Ampro’s shareholding) with a total investment amount of US$20 million.
MSC Vertriebs Acquires ABLE Design
MSC Vertriebs GmbH in Stutensee has acquired the majority stake in ABLE Design GmbH. In addition to sales of standard assemblies with TFT, electroluminescent and plasma displays, ABLE Design, which is located in Munich, focuses mainly on the design of high-quality, customer-specific display solutions.
InterDigital SlimChip Modem Platform Achieves Category 8 HSDPA Speed
InterDigital, Inc. (NASDAQ:IDCC) announced that its SlimChip mobile broadband modem turned in market leading performances in HSDPA benchmark testing conducted by Signals Research Group, an independent research consultancy, and Spirent Communications, who provided its test equipment and engineering support.
Agilent Eliminates Physical Test Points for In-Circuit Tests
Agilent Technologies Inc. (NYSE:A) unveiled a limited access solution for In-Circuit Test (ICT) users that eliminates the need for physical test points, offering benefits that traditional VTEP test cannot provide. The Agilent Cover-Extend Technology is a hybrid between Boundary Scan and VTEP Vectorless Test.
ON Semiconductor, TTTech Team on Time-Triggered Protocol Controller
TTTech and ON Semiconductor (Nasdaq:ONNN) have agreed to join forces to develop a controller for TTP® (Time-Triggered Protocol). This new TTP controller is targeted at cross-industry applications and especially the aerospace market.
Outsourced Power Semiconductor Packaging Markets Report
The trend to outsource packaging requirements to Asia grows among power semiconductor manufacturers due to declining profit margins and escalating competition. Their new business models speed consumer adoption of their products by reducing time to market and production costs.