Fujitsu Develops First New Carbon Nanotube Composite
Fujitsu Laboratories Ltd. announced the successful formation of a new nano-scale carbon composite featuring a self-organizing structure, by combining carbon nanotubes and graphene which are both nano-scale carbon structures.
Magwel Acquires Kimotion Technologies
Magwel NV, a leading provider of electronic 3D device-EM simulation and analysis tools, announced the acquisition of Kimotion Technologies (Leuven, Belgium). Kimotion was founded in 2003 to develop software technology for modeling, optimizing and verifying analog, RF and mixed-signal circuits.
Texas Instruments Introduces TPS780xx Low Dropout Linear Regulators
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced 150-mA, low-dropout linear regulators (LDOs) with dual-level voltage output for MSP430 microcontroller-based, battery-powered devices.
Power Integrations Packs TOPSwitch-HX ICs into eSIP Power Package
Power Integrations (NASDAQ: POWI), the leader in high-voltage analog integrated circuits for power conversion, announced the availability of its TOPSwitch-HX series of AC-DC power conversion ICs in the new eSIP-7C Eco-Single-Inline-Package.
AMCC Partner Program Welcomes Advanced Knowledge Associates
Advanced Knowledge Associates (AKA) – the leader in miniaturized, reconfigurable, fully self-contained and high-performance system-on-module technology – has announced that it has joined Applied Micro Circuits Corporation’s (NASDAQ:AMCC) Partner program.
Elma Bustronic Rolls Out Pico-style MicroTCA Backplanes
Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has announced new MicroTCA backplanes in the Pico style format. The first Pico backplane has been designed for sister-company Elma Electronic’s 1U MicroTCA enclosure solution.
Sierra Wireless Licenses Red Bend vDirect Mobile
Red Bend Software announced that it has signed a licensing agreement with Sierra Wireless (NASDAQ: SWIR – TSX: SW). Sierra Wireless has licensed Red Bend’s device management solution, vDirect Mobile(tm), for Sierra Wireless’s USB modems, PC cards, embedded modules and machine-to-machine (M2M) products.
Tensilica, NuFront Showcase T-MMB Mobile TV Solution at IIC-China
Tensilica,® Inc. and NuFront announced that the two companies will jointly exhibit at the IIC-China 2008 exhibitions March 3-4, 2008, in Shenzhen (booth: 2K41) and March 10-11, 2008, in Shanghai (booth: 4S41).
Massive Software, Hanson Robotics to Demonstrate Zeno Robot at CeBIT
Massive Software announced that it will be exhibiting at CeBIT as part of the New Zealand Trade & Enterprise (NZTE) stand along with other exemplary New Zealand-based technology innovators. CeBIT takes place March 4-9 in Hanover, Germany.