EDA News – 2008.02.19 Late Edition

MathWorks to Discuss Multidomain Modeling, System-Level Verification
The MathWorks will discuss the use of Model-Based Design and embedded systems within the electronic system industry through tutorials and workshops. Experts from The MathWorks will participate in the technical program and provide in-booth demonstrations and presentations on these topics.

Electronics.ca Publishes Report on Wafer Level Packaging
ELECTRONICS.CA announces a report entitled “WLP & Embedded Die Technologies 2008.” Due to the learning curve of the semiconductor industry in terms of chip density versus cost improvements over time, there is a widening gap between the scaling evolutions of the chip front-end and the packaging-assembly manufacturing industries.

AMCC Introduces PowerPC 440EPr Embedded Processor
Applied Micro Circuits Corporation (NASDAQ: AMCC) announced the newest member of its Power Architecture family, the PowerPC® 440EPr processor. The outstanding balance of performance and affordability makes the PowerPC 440EPr the ideal choice for a wide range of cost sensitive applications.

Atmel, SEGGER Team on embOS RTOS for AVR32 Microcontrollers
Atmel® Corporation (Nasdaq: ATML) and SEGGER Microcontroller announced the availability of the real time operating system (OS) embOS for the AVR®32 microcontrollers. The modern AVR32 architecture from Atmel is specially crafted to meet RTOS requirements.

Hilscher cifX Communication Interface Driver Ports to INtime RTOS
TenAsys Corp. announced that the cifX Communication Interface PCI card software driver from Hilscher has been ported to the INtime® RTOS, enabling real-time Windows applications to utilize the wide array of real-time industrial Ethernet interfaces supported by this Hilscher I/O card.

Aeroflex Announces TM500 LTE for 3G Long Term Evolution Test
Aeroflex has introduced the TM500 LTE test mobile designed to address the challenges of 3GPP LTE (3G Long Term Evolution) network infrastructure development test and roll-out. The TM500 LTE’s extensive Layer 1, Layer 2 and higher layer test features make it an indispensable testing peer.

Microchip Design Partner Program Features Over 700 Companies
Microchip Technology Inc. announced its expanded Design Partner Program of more than 700 partners worldwide. Microchip Design Partners receive priority technical support, free extended samples and discounted development tools—enabling them to provide complete solutions quickly and inexpensively.

Inphi Unveils 3200EC Dual CDR with EDC for 10GBASE-LRM XFP Modules
Inphi® Corporation announced the 3200EC 10 Gbps Dual Clock Data Recovery (CDR) with Electronic Dispersion Compensation Engine (EDC) for use in 10GBASE-LRM (LRM) XFP modules. Replacing up to three separate chips, the 3200EC simplifies the design and reduces the bill of materials of an XFP transceiver module.