MIT, TI Create Chip Design with 10x More Energy Efficiency
Researchers at MIT and Texas Instruments (TI) (NYSE: TXN) unveiled a new chip design for portable electronics that can be up to ten times more energy-efficient than present technology. The design could lead to cell phones, implantable medical devices and sensors that last far longer when running from a battery.
Freescale Semiconductor to Acquire SigmaTel
Freescale Semiconductor and SigmaTel, Inc. (NASDAQ: SGTL) announced that they have entered into a definitive agreement for Freescale to acquire SigmaTel. SigmaTel is a leading provider of analog intensive, mixed-signal integrated circuits (ICs) for the digital multimedia market.
Global Semiconductor Alliance Rolls Out IPecosystem Tool Suite 4.0
Global Semiconductor Alliance (GSA) announces the release of its IPecosystem (IPe) Tool Suite Version 4.0 that addresses the risk factors and risk assessments of intellectual property (IP) integration. Version 4.0 includes the Hard IP Licensing Risk Assessment Tool, in addition to the Hard IP Quality Risk Assessment Tool previously released.
GE Fanuc Unveils AXISLite Multiprocessor Software Development Tool
GE Fanuc Intelligent Platforms announced the availability of AXISLite for free download. AXISLite is a reduced functionality version of AXISView, the Advanced Multiprocessor Integrated Software development environment.
Discretix, VisualOn, Axel Debut Mobile TV Solution for Handset OEMs
Discretix, multimedia application provider VisualOn, and mobile TV middleware developer Axel Technologies, have partnered to provide a pre-integrated Mobile TV solution for handset OEMs. The DVB-H-based solution supports both the OMA BCAST Smartcard and DRM Security Profiles.
Vitesse Launches VSC3406 Multi-rate Backplane Transceiver
Vitesse Semiconductor Corporation (Pink Sheets:VTSS) announced the VSC3406, a 6.375 Gigabit per second (Gbps) multi-rate backplane transceiver. The VSC3406 incorporating the latest clock-data recovery (CDR) techniques and signal integrity toolset for backplane and interconnect design.
austriamicrosystems Unveils AS3532 HD Audio Player IC for Music Phones
austriamicrosystems (SWX:AMS) announces the first member of a new family of media player ICs based on innovative IP aimed at bridging the gap between the audio experience of music phones and Hi-Fi home audio devices.
Synopsys Supports USB 2.0 Link Power Management, High Speed Inter-Chip
Synopsys, Inc. (NASDAQ: SNPS) announced a major expansion to its leading DesignWare® USB IP product line with support for the USB 2.0 Link Power Management (LPM) and High Speed Inter-Chip (HSIC) standards. The new DesignWare USB LPM and HSIC digital controller and PHY IP reduce power consumption and area for USB-enabled chips.
DAFCA, GiDEL Team on SoC Verification, Debug Tools
DAFCA Incorporated and GiDEL announced the establishment of a multi-faceted technology collaboration. DAFCA and GiDEL will work closely to extend and enhance the integration of their two product families, so that the resulting products will deliver a comprehensive suite of verification/debug tools for teams using GiDEL’s reconfigurable PROC(tm) systems and DAFCA’s ClearBlue(tm) reconfigurable instruments.
Microchip Announces Academic Partner Program
Microchip Technology Inc. announced the creation of the new Microchip Academic Partner program, providing an opportunity for academia to partner with a semiconductor industry leader to increase their knowledge base in embedded applications. The program is also expanding beyond universities to the K-12 grade levels.
Xilinx Presents, Demonstrates at DesignCon 2008
Xilinx Inc. (Nasdaq: XLNX) outlined plans for participation at the DesignCon 2008 conference, including an FPGA industry business forum panel, DesignVision awards, high-speed serial backplane conference session and a Virtex(TM)-5 FPGA enabled cell broadband demonstration.