Texas Instruments Unveils TPS61170 40-V Boost Converter
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced a tiny, high-voltage boost converter with an integrated 40-V, 1.2-A FET and a wide input-voltage range of 3-V to 18-V. The high-efficiency device supports boost, SEPIC (single-ended primary inductor converter) and flyback topologies, which are used to regulate single or dual Li-Ion battery inputs. Available in a 2 mm x 2 mm QFN package, the converter simplifies design in industrial or medical point-of-load applications, such as 5-V to 12-V or 12-V to 24-V systems.
Chipidea Develops Class D Audio Driver IP
Chipidea, the Analog Business Group of MIPS Technologies, Inc. (NASDAQ: MIPS), introduced the industry’s first Class D Audio Driver intellectual property (IP) specifically designed for system-on-chip (SoC) devices manufactured in process nodes down to 65nm. Chipidea’s analog/mixed-signal Class D Audio Driver IP addresses the explosive growth of markets for portable consumer audio devices including MP3 players, smart phones with integrated audio capability, handheld GPS systems and others where the requisite integrated audio feature set and demand for extended battery life continue to challenge both IC designers and end-product manufacturers.
Actel Announces IGLOO FPGA Solutions for LCD Control Applications
With a continued focus on delivering low-power solutions for emerging and high-growth portable applications, Actel Corporation announced the availability of flexible solutions for liquid crystal display (LCD) control applications. The new IGLOO Video Demo Board, LCD adaptor boards with LCD panels, the IGLOO Video Demo Kit (IVDK) and display-related reference blocks leverage the company’s industry-leading 5 microwatt (µW) Actel IGLOO field-programmable gate arrays (FPGAs). The company expects these offerings will be attractive to the power-sensitive designers of portable and handheld consumer, industrial, medical, automotive and military devices that utilize small-to-medium LCD displays.
Frost & Sullivan Publishes Report on SMD Placement for PCB Market
Software capability and feeder designs represent the key highlights for new surface mount device (SMD) placement machines. In particular, an easy configuration process for the automated assembly line emphasizes the changeover during production and zero-downtime feature. Better robotic controls, user interface, programming, radio frequency identification (RFID) tags, intelligent feeder designs and other add-ons all assist with easy configuration.
Linux Phone Standards Forum Releases LiPS 1.0 Specifications
The Linux Phone Standards (LiPS) Forum announced completion of the LiPS Release 1.0 specifications, fulfilling the commitment announced in June of this year. With this release, LiPS enables mobile industry players to achieve basic interoperability for applications and services deployed on Linux-based phones, benefiting Linux-based software stack suppliers, mobile device OEMs and regional and global telecom operators. These specifications include the LiPS Reference Model, Telephony, Messaging, Calendaring and Scheduling, Presence, User Interface Services, Address Book and Voice Call Enablers APIs.
IDT Rolls Out Low Power, High Definition Audio Codecs
IDT® (Integrated Device Technology, Inc.; NASDAQ: IDTI), a leading provider of essential mixed-signal semiconductor solutions that enrich the digital media experience, introduced three new high definition PC audio codecs. The high fidelity audio codecs are designed to help bring home-entertainment-level audio fidelity to next generation desktop and high-end notebook systems, all while supporting mobile user capabilities such as advanced processing for voice over Internet protocol (VoIP). Demonstrating the IDT commitment to providing customers with the lowest possible power consuming devices, the new IDT codecs offer unprecedented levels of power efficiency for both desktop and notebook applications.
Mentor Graphics Creates Multi-mode Multi-corner Signal Integrity Solution
Mentor Graphics Corporation (Nasdaq: MENT) announced new technology in its Olympus-SoC(TM) place and route product that dramatically accelerates signal integrity (SI) closure and improves the reliability of manufactured silicon. The Multi-Corner, Multi-Mode (MCMM) capability of Olympus’ Static Timing Analysis (STA) engine concurrently computes delay shift and glitch for any number of mode/corner scenarios in a single pass. MCMM analysis enables customers to address reliability issues such as crosstalk delay, glitch, power, and electromigration while reducing the time to achieve design closure. The Olympus-SoC product’s detailed routing and optimization engines have been enhanced to help eliminate SI violations concurrently over all variation scenarios.
Altera Announces New Zero-Power MAX IIZ CPLD
Expanding its low-power portfolio of programmable logic solutions, Altera Corporation (NASDAQ: ALTR) announced the new, zero-power MAX® IIZ CPLD designed specifically to address the power, package and price constraints of the portable applications market. Offering a resource advantage of up to six times the density and three times the I/Os compared to competing traditional macrocell-based CPLDs, MAX IIZ devices allow designers to meet changing functional requirements at the same or lower power while saving board space. Adding zero-power and ultra-small packages to the most popular CPLD series in the industry, the MAX IIZ devices deliver the many benefits of CPLDs—including flexibility, faster time to market, and board-level integration—to handsets and other portable applications.