Summit SMB137 Programmable Battery Charger IC
Summit Microelectronics’ SMB137 programmable battery charger IC was designed for mobile consumer electronics. Dual (USB or AC/DC) inputs and outputs (System or Battery) with CurrentPath(TM) automatic arbitration allow system operation with any input source, any battery charge state, or even missing battery. Proprietary TurboCharge(TM) technology yields dramatic reductions in charge time, power dissipation, and solution size compared to conventional charger solutions. The ultra-small solution size, combined with Micro-USB data/power support, enables ultra-thin devices with the convenience of USB battery charging.
IEEE 1588 Clock Synchronization for Lattice FPGA
Today Lattice Semiconductor Corporation (NASDAQ: LSCC) announced the availability of Industrial Ethernet Intellectual Property (IP) from Oregano Systems Design and Consulting. Oregano ported their IEEE 1588 IP core for clock synchronization over Ethernet to the LatticeXP(TM) and LatticeXP2(TM) FPGA families. Oregano’s IP core implements a popular IEEE standard that is used for many Industrial Ethernet applications to ensure that the various nodes in a network have synchronized real time clocks. The solution can be delivered as a standard IP core or Oregano can program it onto a LatticeXP or LatticeXP2 device and deliver it as an Application Specific Standard Product (ASSP).
NEC 15-inch LCD Modules
NEC LCD Technologies recently introduced two new 15-inch [38 centimeters (cm)-diagonal] amorphous-silicon color thin-film-transistor (TFT) liquid crystal display (LCD) modules with extended graphics array (XGA) resolution for industrial equipment such as factory automation controllers, measuring instruments, automatic teller machine (ATM) terminals, kiosks, and point-of-sale (POS) systems. The NL10276BC30-32 is a standard product with brightness of 250 candelas per square meter (cd/m2), while the NL10276BC30-33 has brightness of 350 cd/m2. Both modules conform to the Panel Standardization Working Group (PSWG) standards for 15-inch LCD modules.
Xilinx SPI-4.2 and SFI-4.1 Solutions
Xilinx Inc. (Nasdaq: XLNX) has developed solutions for the Optical Internetworking Forum (OIF) System Packet Interface (SPI) 4.2 and SerDes Framer Interface (SFI) 4.1 standards, the industry’s highest performance channelized packet interfaces. Xilinx’s solutions are based on Virtex(TM)-5 LXT FPGAs and feature the ML550 hardware verification board, SPI-4.2 LogiCORE(TM) IP, and SFI-4.1 reference design. Verified across multiple FPGA platforms, the solutions accelerate the design cycle of wired networking systems that require OC-192 (10 Gbps), multiple OC-48 (2.5 Gbps) or 10 Gbps Ethernet interfaces, resulting in much faster time-to-market than competing solutions.
STMicroelectronics LIS331 Motion Sensors
STMicroelectronics (NYSE: STM) introduced a new generation of ‘nano’ three-axis linear accelerometers. The low-power MEMS sensors provide complete output flexibility and embedded smart features. ST’s new 3-axis motion sensors represent a significant step forward in the product’s miniaturization. The 3x3x0.9mm plastic package addresses the space and weight constraints of portable electronic devices. The LIS331 accelerometers deliver high performance at low power consumption and their ultra-compact robust design provides very high immunity to vibration and shock survivability up to 10,000g.
Webinar: How to Quickly Design a Low-Cost ASIC
NEC and Tensilica are sponsoring a webinar on how to quickly design low-cost custom logic. The webcast will take place on Thursday, December 6th at 11 am Pacific (2:00 pm Eastern). The seminar will focus on designing low-cost ASICs using synthesizable 200-megahertz (MHz) 32-bit controllers.
TI TMS320C6452 Digital Signal Processor
Texas Instruments Incorporated (TI) (NYSE: TXN) recently announced the availability of the TMS320C6452 digital signal processor (DSP). The DSPs are designed to optimize price and performance for today’s process intensive multi-channel infrastructure and medical imaging systems. With a more than 30% price reduction over TI’s popular TMS320C6415T DSPs, the new code compatible 900 MHz C6452 DSP allows designers to quickly and easily migrate their designs from the widely deployed C641x based products.
Xilinx SpeedWay Workshops
Avnet Electronics Marketing announced a new series of SpeedWay Design Workshops(TM) featuring Xilinx® technology. The workshops are available in locations across the U.S. through March 2008.
GreenPeak Battery-Free Wireless Communication Devices
GreenPeak Technologies recently introduced new products for ultra-low-power wireless sense and control networks. GreenPeak’s new wireless communication devices leverage three key technologies that enable it to operate in a battery-free environment without cabling. The first is an ultra-low-power wireless transceiver and sensor interface design with efficient power-up and power-down modes that dramatically reduce power consumption. Second is an energy harvesting interface that enables the modules to utilize power provided by e.g. external solar, electromagnetic, and piezo-electric transducers. Third is a mesh technology that enables designers to create extended sensor networks without the need for battery-powered or cabled routing nodes. This innovative mesh technology is also self-forming and self-healing, making it easy and inexpensive to install.
Microtronix ViClaro III Video IP Development Kit
Microtronix, with the help of Altera, recently developed the ViClaro III HD Panel Display Interface – Video IP Development Kit. The ViClaro III kit helps high-definition (HD) video display designers build highly integrated, next-generation HD 1080p, 100-/120-Hz frame rate conversion television sets or panel display systems. The ViClaro III kit, which uses the Cyclone III FPGA as its engine, provides a comprehensive engineering design and evaluation platform. With the kit, designers can efficiently develop video-processing IP algorithms to support an array of display applications providing superior picture quality.
ARM RealView Profiler
ARM (LSE:ARM) (Nasdaq:ARMHY) recently launched their RealView(R) Profiler, which is a tool for non-intrusive analysis of software performance and code coverage of real system workloads running over minutes, hours, or days. Using the tool, developers can typically improve the performance of their application by more than 20%, while at the same time reducing ROM size requirements by a similar amount. The RealView Profiler also includes comprehensive analysis of both statement and branch code coverage, enabling software testing to achieve and demonstrate 100% code coverage to ensure the highest levels of software validation.
Programmable Solutions India 2007
Xilinx, Inc. (Nasdaq: XLNX) and CG-CoreEl will host Programmable Solutions India 2007 on December 11, 2007 in Bangalore and December 13, 2007 in Hyderabad. The events offer a full-day, complimentary line-up of keynotes, presentations, demonstrations and solution centre exhibits at each location to showcase industry-leading programmable solutions. Attendees will learn about silicon, IP, software, solutions and services from Xilinx and its network of solution providers, including Avnet, Nu Horizons, Agilent Technologies, Mentor Graphics, Wind River, iWave, Synplicity, and Nital.
GE Fanuc CC11, CL11 Single Board Computers
GE Fanuc Embedded Systems recently introduced their CC11 and CL11 3U CompactPCI single board computers. The SBCs feature a choice of Intel® Celeron® M (1.06 GHz), Core(TM) Duo (up to 2.0 GHz) or Core(TM)2 Duo (1.5 GHz) processors and up to two Gigabytes of onboard DDR2 SDRAM, each can be ordered as either a system slot or non system slot device. Designed for a broad range of applications including automation, transportation, imaging, medical and robotics, the CC11 and CL11 take maximum advantage of the benefits of CompactPCI in its 3U form factor, delivering high performance in a small, lightweight package. Each board is available in extended temperature range (-40° C to +75° C) forms to enable installation in environments that would otherwise be unsuitable.