SONiVOX Donates audioINSIDE Technology to Open Handset Alliance
SONiVOX announced that it will contribute its audioINSIDE(TM) technology to the Open Handset Alliance, bringing advanced music playback capabilities to this benchmark initiative. SONiVOX audioINSIDE is an advanced, device-hardened audio synthesis solution with high quality MIDI audio capabilities primarily utilized to create interactive mobile gaming applications.
PacketVideo Helps Form Open Handset Alliance
In a giant evolutionary step forward for the rapid development of mobile media devices, PacketVideo Corporation (PV) has joined the Open Handset Alliance as a founding member, along with more than 30 other industry leaders. PV, a subsidiary of NextWave Wireless Inc. (NASDAQ:WAVE), is an award-winning creator of embedded software solutions that run the world’s leading mobile entertainment services.
Open Handset Alliance Debuts Android Open Platform for Mobile Devices
A broad alliance of leading technology and wireless companies joined forces to announce the development of Android, the first truly open and comprehensive platform for mobile devices. Google Inc., T-Mobile, HTC, Qualcomm, Motorola and others have collaborated on the development of Android through the Open Handset Alliance, a multinational alliance of technology and mobile industry leaders.
NI Rolls Out Smart Cameras for Machine Vision, Industrial Inspection
National Instruments (Nasdaq:NATI) announced the NI 1722 and NI 1742 Smart Cameras to provide engineers and scientists with high-performance systems at a low cost. The NI Smart Cameras are embedded devices that combine an industrial controller with an image sensor and integrate with NI vision software to offer image processing directly on the cameras, making them ideal for applications such as locating parts, inspecting packaging, verifying assembly and reading 1-D and 2-D codes.
Interlaken Alliance Releases Interoperability Guidelines
The Interlaken Alliance, a group of companies who are collaborating on creating component interoperability recommendations, released interoperability guidelines for components implementing Interlaken interfaces. Interlaken, an open specification for high-speed chip-to-chip packet transfers using the latest serial technology, enables component manufacturers to scale their devices to 100 Gbps. These implementation recommendations help networking equipment builders by enabling a wide range of interoperable silicon components.
GAO TEK Upgrades DS1185 (B) Super Signal Level Meter
GAO Tek Inc. is introducing an upgrade to its DS1185 (B) Signal Level Meter. The newly developed model, DS1185 (B) Super Signal Level Meter, is designed to provide features which are most widely used and favored by professionals in the CATV industry. Key functions include measuring and displaying amplitude at predefined frequencies or carriers. In addition, the feature of peak-hold level measurement in the LEVEL and SPECTRUM mode can even detect the occasional disturbance.
Ibeo Laser Sensors Power DARPA Urban Challenge Winners
The future of safe road traffic belongs to laser technology. This was demonstrated at the race for driverless cars, the DARPA Urban Challenge in the USA. The winning Tartan Racing Team, the second-place Stanford Racing Team and the third-place Victor Tango Team in the finals held on 3 November used Ibeo laser sensors. The high-performance sensors were the racing vehicle’s smart eyes. Besides these teams, another 3 additional vehicles in the race used the laser scanners made in Germany.
Microchip Introduces PIC32 32-bit Microcontrollers
Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, announced the PIC32 family of 32-bit microcontrollers (MCUs). The PIC32 family adds more performance and more memory while maintaining pin, peripheral and software compatibility with Microchip’s 16-bit MCU/DSC families. To further ease migration and protect tool investments, the PIC32 family is fully supported by Microchip’s free MPLAB® Integrated Development Environment (IDE). The MPLAB IDE offers unprecedented compatibility by supporting Microchip’s complete portfolio of 8-, 16- and 32-bit devices.
Eclipse Foundation Announces Hibachi Open Source Ada Project
The Eclipse Foundation announced the creation of a new open-source project called Hibachi. The Hibachi project provides an industrial-strength, vendor-neutral Ada integrated development environment (IDE) that also serves as a platform for other contributors to provide value-added functionality for Ada developers. Hibachi is a sub-project of the Eclipse Tools Project, and it parallels and complements CDT, the C/C++ Development Tooling project, providing a multi-language native embedded software development environment. The name Hibachi is an anagram honoring the late Jean Ichbiah, lead designer of the Ada language.
Synplicity, Lattice Team on ESL Synthesis Flow for DSP Design
Synplicity, Inc. (NASDAQ:SYNP), a leading supplier of innovative IC design and verification solutions, and Lattice Semiconductor (NASDAQ: LSCC), a leading supplier of FPGAs, have expanded their relationship to include delivery of a highly optimized, non-proprietary ESL synthesis flow for DSP design. Synplicity’s Synplify® DSP software now supports the LatticeECP2M(TM) and LatticeXP2(TM) Field Programmable Gate Array (FPGA) devices, creating a powerful solution for DSP algorithm implementation in aerospace, wireless, telecom and digital multimedia applications.
Tensilica Adds More Features to Diamond Standard Processor Cores
Tensilica®, Inc. announced that it has enhanced its successful Diamond Standard processor product line, the lowest-power, most area-efficient and highest-performance licensable cores on the market. The new second-generation Diamond Standard processors include several new features including additional multiplier and divider functional units, several hardware optimizations that lower memory power by up to 30 percent, and an optional bridge to AXI-based AMBA systems.
Tensilica Rolls Out Diamond Standard 106Micro Processor Core
Tensilica®, Inc. unveiled the industry’s smallest licensable 32-bit processor core based on an industry-standard architecture. The new Diamond Standard 106Micro core takes up only 0.26 mm2 in a 130-nm G process and only 0.13 mm2 in a 90-nm G process, which makes it smaller than the ARM7 or Cortex-M3 cores, yet at 1.22 Dhrystone MIPS/MHz, it delivers higher performance than the ARM9E cores.
Cypress Announces PSoC FirstTouch Embedded Design Starter Kit Webinar
Cypress Semiconductor Corp. (NYSE:CY) announced a free online seminar that uses the PSoC® FirstTouch(TM) Starter Kit to demonstrate how embedded designers can cut time to market with PSoC mixed-signal arrays. The 60-minute seminar entitled “On-Time Embedded Development with Cypress PSoC Mixed-Signal Arrays and the Cypress PSoC FirstTouch Embedded Design Starter Kit,” will be presented in conjunction with CMP Media’s Electronic Engineering Times on Wednesday, November 7 at 9:00 a.m. PDT.
Xilinx, Thales Showcase Reconfigurable FPGA-Based Architecture
Xilinx, Inc. (Nasdaq: XLNX), the world’s leading provider of programmable chips, and leading defense aerospace and security contractor Thales announced they will demonstrate a partially reconfigurable FPGA-based single chip architecture in a SCA (Software Communication Architecture) compatible environment for military radios at the Software Defined Radio Technical Conference (SDR’07).