TI Creates RF360 Smart IC Platform for Secure Government Electronic ID
In a market-moving shift to offer significant improvements in write speed and operational performance, Texas Instruments Incorporated (TI) (NYSE: TXN) unveiled the RF360, the first smart integrated circuit (IC) platform to be developed specifically to meet the rigorous demands of the contactless government electronic identification market.
NEC Debuts V850E/PHO3 32-Bit FlexRay-Based Automotive Microcontroller
NEC Electronics America, Inc. expanded its comprehensive lineup of automotive microcontrollers (MCUs) with the 32-bit all flash V850E/PHO3(TM) MCU optimized for chassis and inverter control applications that require control of up to two 3-phase brushless DC motors simultaneously, such as electronic power steering, electronic braking, damping and other vehicle-stability control applications. Featuring an embedded FlexRay(TM) controller, the V850E/PHO3 MCU is well suited for advanced network architectures and future x-by-wire applications. The new device is the first NEC Electronics MCU to include an embedded FlexRay communications controller based on E-Ray intellectual property (IP) licensed from Robert Bosch GmbH.
ADLINK Unveils PCIe-RTV24 4-Channel PCI Express Video Capture Card
ADLINK Technology, Inc. announces the PCIe-RTV24, a high speed video capture card supporting four channels of NTSC/PAL, EIA/CCIR input. Based on the PCI Express® bus, the PCIe-RTV24 offers the higher bandwidth required by machine vision, security, and video surveillance applications, such as position location, biometric face recognition, and vehicle license plate identification.
Texas Instruments Creates Dual-output SWIFT Converters
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced four new dual-output SWIFT(TM) DC/DC step-down converters with integrated FETs that deliver 2-A and 3-A of continuous output current and support input voltages of 4.5 V to 28 V. The simple-to-design switchers, which come in a monolithic package, speed time to market, reduce external component count and help reduce cost for point-of-load systems used in a wide variety of applications including HDTVs, set-top boxes and other consumer electronic systems.
TI DSPs Receive Approval for DTS-HD Master Audio
Committed to innovations that provide the highest performance audio quality, Texas Instruments Incorporated (TI) (NYSE: TXN) announced that its audio digital signal processors (DSPs) are the first embedded implementation approved with DTS-HD master audio at 192 kHz for unparalleled audio quality in home theater systems. Audio/video receivers (AVRs) based on TI’s award-winning DA7xx generation of DSPs have the power to fully support eight channels of 192 kHz lossless audio that is bit-for-bit identical to the original audio source, which allows home theater systems to sound exactly as the filmmaker intended. With the full certification of DTS-HD Master audio and DTS-LBR (Low Bit Rate), DA7xx DSPs are the first audio processors approved for both DTS-HD and Dolby TrueHD, and can support all audio formats present on next-generation HD DVD and Blu-Ray discs.
Chipworks Analyzes Matsushita 45nm UniPhier SoC Device
Chipworks, the leader in reverse engineering and technical analysis of semiconductors and microelectronic systems announced the arrival, in their labs, of the first production Matsushita UniPhier SoC device. Chipworks has confirmed that it is manufactured using a 45 nm process technology. Further imaging and analysis continue.
ABI Research Comments on M2M Module Commoditization
Wavecom, a leading M2M wireless module vendor, recently announced a partnership with M2M mobile operator Jasper Wireless to offer Wavecom’s “StarService” on Jasper Wireless’ global service platform. StarService, which enables customers to obtain the WM50 module from Wavecom for free with the remote device management service, is an interesting approach toward ameliorating the commoditization pressures facing the wireless module industry. These pressures include tightening gross margins in the short term, and anxiety over possible obsolescence of modules in the M2M value chain over the longer term, as wireless connectivity potentially becomes directly integrated into end-equipment.
Synopsys Donates oaViewer to OpenAccess Coalition
The Silicon Integration Initiative (Si2) announced that Synopsys has donated an oaTcl-based OpenAccess graphical visualization program (oaViewer) to the OpenAccess Coalition. OaViewer will be demonstrated at the OpenAccess Conference on November 5, 2007 at the Sun Microsystems Santa Clara Conference Center.
Sarnoff Licenses Carbon Design Systems Model Studio
Sarnoff Corporation and Carbon(TM) Design Systems announced that Sarnoff has licensed Carbon’s model generation technology to develop cycle-accurate system models directly from its Register Transfer Level (RTL) source code. Sarnoff will use the models to create a virtual prototype of its high-performance, ARM-based system on chip (SoC). This platform will give Sarnoff a time-to-market advantage as it develops its next low-power, mobile vision product line.
The MathWorks Presents Model-Based Design at SAE Congress
Peter Maloney of The MathWorks will participate on a panel with participants from Cummins, General Motors, International Truck and Engine Corp., John Deere and Ohio State University to discuss analytical engine calibration techniques. Experts from The MathWorks will present papers about applying Model-Based Design to the commercial vehicle industry. Jon Friedman of The MathWorks will co-chair a two part session on Model-Based Design (Embedded Systems).
Advanced Knowledge Associates Announces ARINC 429 IP Core
Advanced Knowledge Associates (AKA) – the leader in miniaturized, reconfigurable, fully self-contained and high-performance system-on-module technology – announced that it has added the ARINC 429 core to the extensive portfolio of IP integrated within its range of Prepackaged Reconfigurable Integrated System-on-Module (PRISM) solutions. Based on industry-standard programmable logic platforms and including processor cores and the necessary I/O and peripheral circuitry, these building blocks are fast replacing other custom and standard platforms as they reduce system size, cut costs, minimize time to market and protect against obsolescence.