Semiconductor Test Consortium Publishes STIX Terminology Specifications
The Semiconductor Test Consortium, Inc. (STC), the leading proponent of the development and adoption of value-added open test standards that benefit the semiconductor industry, announced that its Docking & Interface Working Group (DIWG) has published the first draft of terminology specifications for the Semiconductor Test Interface eXtensions (STIX(TM)) initiative. In addition, the consortium also announced it will be organizing several key activities related to the STIX initiative at the International Test Conference (ITC) on October 23rd to the 25th in Santa Clara, California. Activities include working group meetings, as well as a booth presence and the annual consortium dinner event. Both efforts build on the already strong momentum around the STIX initiative — aimed at addressing rising cost and efficiency challenges in the automatic test equipment (ATE) arena, through the collaborative efforts of companies spanning the semiconductor supply chain.
austriamicrosystems Debuts AS1538 12-Bit, 8-Channel, Low Power ADC
austriamicrosystems (SWX:AMS), a leading global designer and manufacturer of analog ICs for communications, industrial, medical and automotive applications, has introduced the AS1538 – an I²C interfaced ADC with power consumption in the uA range, expanding austriamicrosystems high-performance ADC portfolio. The AS1538 combines low-power operation, maximum possible conversion speed for I²C and fully-differential or single-ended analog input modes together with outstanding dynamic performance (THD -75dB) in a 16-pin TSSOP package. All this and its ease of use makes the AS1538 well-suited for 2.7 to 5.25V battery-powered and industrial applications using an I²C bus.
International Rectifier Unveils IRS2336xD Three-Phase 600V IC
International Rectifier, IR® (NYSE:IRF), a world leader in power management technology, introduced the IRS2336xD protected 600V three-phase gate driver ICs with integrated bootstrap functionality for appliance motor control, servo drives, micro-inverter drives, and a wide range of general purpose applications.
Vendors Ship 288 Million Mobile Devices in Third Quarter
With quarterly results now reported from Samsung, LG, Sony Ericsson, and Nokia, “ABI Research believes 3Q-2007 has seen strong performance that has gone against the flow of bad news in the global economy, as well as, to a degree, in the wireless infrastructure market,” says Jake Saunders, Asia-Pacific vice-president. “The spotlight will now fall on Motorola as industry observers ponder whether Motorola’s turnaround strategy is starting to generate results.”
Michael Keating Keynotes Synopsys EDA Interoperability Forum
Synopsys, Inc. (Nasdaq:SNPS), a world leader in software and IP for semiconductor design and manufacturing, announces that its 20th electronic design automation (EDA) Interoperability Developers’ Forum will feature keynote speaker Michael Keating, Synopsys Fellow and lead author of the recently released “Low Power Methodology Manual” (LPMM).
Cypress Announces LUPA-1300-2 High-Speed SXGA CMOS Image Sensor
Cypress Semiconductor Corp. (NYSE:CY) announced the commercial sampling of a high-sensitivity, high-speed SXGA (Super Extended Graphics Array) resolution CMOS image sensor. The new 1.3 Mega pixel LUPA-1300-2 sensor is the industry’s first to offer a triggered and pipelined synchronous shutter and on-chip digital LVDS (Low Voltage Differential Signaling) outputs. Developed for machine vision and motion analysis applications, the image sensor features a high frame rate of 500 frames-per-second (fps) and windowing capability that delivers undistorted images and fast readout.
Extreme DA, Magma Debut Statistical Models for Timing Sign-off of ICs
Extreme DA(TM) and Magma® Design Automation (NASDAQ: LAVA) announced the availability of the jointly developed statistical library models for analysis and optimization of integrated circuit (IC) designs, enabling the Magma SiliconSmart® DFM characterization system to automatically generate models for statistical timing analysis using Extreme DA’s GoldTime(TM). Using the cell models produced by SiliconSmart with GoldTime analysis, designers can achieve higher yield and better performance in their 65- and 45-nanometer (nm) ICs.
IEI Launches PCIE-Q350 CPU Card, IMB-Q354 microATX Industrial Motherboard
IEI Technology Corp., the leading industrial computer system provider, announced the launch of the PCIE-Q350 PICMG 1.3 CPU card and IMB-Q354 microATX industrial motherboard. The Intel® Q35 Express Chipset is integrated into both the PCIE-Q350 and IMB-Q354 and is interfaced through a scalable 1333/1066/800 MHz front side bus (FSB) to an Intel® Core(TM) Duo processor or a future 45nm core Intel® processor.