LogicVision Introduces ETMemory On-Chip eDRAM Test, Repair Solution
LogicVision, Inc. (Nasdaq: LGVN), a leading provider of test and yield learning capabilities for the semiconductor industry, announced that its ETMemory(TM) product line now fully supports built-in-self-test and built-in self-repair of embedded DRAMs (eDRAMs). ETMemory is widely used for testing embedded SRAMs at leading semiconductor and system companies worldwide. Building on that success, LogicVision has now added the critical requirements for test and self-repair of eDRAMs. LogicVision will demonstrate ETMemory for eDRAM at the 2007 International Test Conference, Oct 23-25, in Santa Clara, CA.
Toshiba Validates MII’s Imprint Lithography for 22nm Node
Molecular Imprints, Inc. (MII) announced that Toshiba Semiconductor Company, a global leader in the development and manufacturing of powerful semiconductor devices, has validated the use of MII’s imprint lithography technology in developing 22-nm node CMOS devices. Toshiba fabricated narrow trench features at dimensions down to 18 nm using MII’s Imprio(R) 250 system. Toshiba presented its findings in a paper titled “Nanoimprint Applications Toward 22-nm Node CMOS Devices” at the 33rd International Conference on Micro- and Nano-Engineering (MNE) in Copenhagen, Denmark.
SyntheSys Introduces BERTScope PCI Express Test Bench
SyntheSys Research, Inc., introduces the new PCIe Test Bench by BERTScope, the first complete solution for PCI Express® transmitter and receiver physical layer compliance testing at 2.5 and 5.0 GT/s rates. Conventional approaches use multiple instruments to cover compliance which are expensive, physically large and complex to configure. This also impacts the repeatability of results and the knowledge level required of the engineer performing the measurements. The PCIe Test Bench provides all equipment and accessories needed to make compliance measurements easy.
Synopsys Joins Governing Steering Committee of OCP-IP
Open Core Protocol International Partnership (OCP-IP) announced that Synopsys, Inc. (NASDAQ: SNPS), a world leader in semiconductor design software, has joined the OCP-IP Governing Steering Committee (GSC). Synopsys’ membership augments a highly talented team drawn from members including Nokia, Texas Instruments, Toshiba, and Sonics Inc. Synopsys is already active in OCP-IP’s working groups, and their DesignWare® Verification IP for the OCP interface is a part of the CoreCreator verification toolset that all OCP-IP members receive. By joining the GSC, Synopsys, with its extensive SoC design and verification experience, will contribute to OCP-IP’s charter to help ensure plug and play interoperability between on-chip blocks, IP and subsystems.
Rambus Creates Memory Controller Interface Solution for DDR3 DRAM
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed memory architectures, announced the introduction of its memory controller interface solution for industry-standard DDR3 DRAM. The fully integrated hard macro cell provides the physical layer (PHY) interface between the controller logic and DDR3 or DDR2 DRAM devices for data rates of up to 1600 MHz.
Anchor Bay Verifies HDTV, Digital Video Products with Cadence Tools
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced that Anchor Bay Technologies, a leading developer of advanced video processing chips and system-level solutions for HDTV and high-resolution digital video, has adopted the Cadence® Incisive® Xtreme® III acceleration and emulation system. Anchor Bay has successfully employed the system on several designs, and found that it has significantly improved design team verification productivity, product quality, and schedule predictability.
Kontron, Enea Showcase ATCA Streaming Media Platform
Kontron, a leading global provider of open modular solutions for the communications market, and Enea, a leading provider of network software and services, will showcase a jointly developed, AdvancedTCA, high availability streaming media platform at the ATCA Summit in Santa Clara, California.
fimicro Selects Ramtron FM22L16 4Mb FRAM for PC/104 SBC, I/O Modules
Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of non-volatile ferroelectric random access memory (FRAM) and integrated semiconductor products, has announced that German-based embedded hardware and software provider, fimicro, has integrated non-volatile FRAM memory into its new active104 series of PC/104-compliant single board computer (SBC) and smart I/O extension modules.
ARTiSAN Studio 6.2 Passes Microsoft Platform Test
ARTiSAN Software Tools, the global leader in the provision of an integrated UML, SysML and architectural framework tool suite for the analysis, design and development of complex, mission critical systems, has announced that ARTiSAN Studio 6.2 has passed the Microsoft platform test for ISV/software solutions for Windows Server, Windows Client and Microsoft Office. The testing was conducted independently by VeriTest, a testing service of Lionbridge Technologies. As a consequence of the successful testing, ARTiSAN Software Tools’ Microsoft Certified Partner status is now compliant with the latest version of ARTiSAN Studio.
Electronics.ca Publishes Thin Film Transistor Circuits Report
Electronics.ca Publications, the electronics industry market research and knowledge network, announces the availability of a new report entitled “Printed and Thin Film Transistors and Memory.” What new electronic product is being researched by organizations in over 30 countries but none have sold anything yet? According to this new report, the answer is Thin Film Transistor Circuits (TFTCs), which do not employ traditional crystalline or amorphous silicon, germanium or gallium arsenide and that can therefore be deposited at high speeds onto low cost flexible substrates.
IMEC, PRC Offer Program for Flip-chip, Substrate Technology
The Microsystems Packaging Research Center at the Georgia Institute of Technology (PRC)-Atlanta. Ga., and IMEC invite interested parties from global industry to join their advanced research program on next-generation flip-chip and substrate technology. The program addresses the key ‘IC-to-package to board’ packaging interconnect issues for 32nm ICs and beyond.
Matrox Graphics Rolls Out Millennium P690 Fanless Graphics Cards
Matrox Graphics Inc., the leading manufacturer of professional graphics solutions, announced the availability of its Millennium P690 Series fanless graphics cards. These cards are available in several form factors, offer low power consumption, and unified display drivers for easy deployment across multiple systems. In addition, the P690 Plus LP PCI/PCIe products can be upgraded (via a Quad-HD15 cable) to drive four analog monitors—and up to eight analog or four digital monitors in a joined-graphics card configuration.
IMEC Develops Wireless ECG Patch for Heart Monitoring
IMEC has developed a wireless ECG (electrocardiography) patch for the continuous monitoring of cardiac activity and heart rate. Wearable, wire-free and easy to set-up, the system removes disturbances and discomfort caused by current cardiac monitoring systems. This is a major advantage for body-worn sensors, a key theme in the Human++ program within the Holst Centre.