Berkeley Design Technology Reveals Benchmarks for picoChip PC102
Berkeley Design Technology, Inc. (BDTI) has concluded its first public benchmarking of a massively parallel multicore processor, the picoChip PC102 from picoChip Designs Limited. In this landmark effort, BDTI used its BDTI Communications Benchmark (OFDM)(TM) to evaluate the performance of the PC102, a programmable multicore digital signal processor containing 308 heterogeneous processor cores and 14 coprocessors. The BDTI Communications Benchmark (OFDM) is an application-oriented benchmark based on an orthogonal frequency division multiplexing (OFDM) receiver and is representative of the baseband processing found in many current and emerging wired and wireless communications applications.
Stream Processors Reduces Power with Sequence Design’s PowerTheater
The provider of the world’s most powerful Digital Signal Processor (DSP) platform, Stream Processors Inc. (SPI) chose Sequence Design’s PowerTheater for early power management and low-power architecture evaluation for their new processor design, reducing power 20-50%.
LeCroy Announces WaveRunner, WaveSurfer M-Type 1 GHz Oscilloscopes
LeCroy® Corporation introduces two M-Type 1 GHz oscilloscopes that provide the highest signal fidelity, most complete measurement capability, and best raw performance in the 1 GHz bandwidth class. Available in the popular WaveRunner® and WaveSurfer® product series, the M-Type oscilloscopes bring LeCroy’s award-winning large display/small footprint, 5 GS/s sampling rate and form factor to 1 GHz oscilloscopes.
Lockheed Martin Selects Enea’s Polyhedra RDBMS for Merlin Helicopter
Enea (Nordic Exchange/SmallCap/ENEA), a world leading provider of network software and services, announced that Lockheed Martin UK has selected its Polyhedra(TM) database management system for use in the Merlin Capability Sustainment Program (MCSP). Polyhedra will be used to provide reliable, real-time data storage and management for the Merlin Helicopter’s Tactical Mission Computer (TMC) System.
Tower Semiconductor Ramps Up Production of ViTi’s CMOS Image Sensors
Tower Semiconductor, Ltd. (NASDAQ:TSEM)(TASE:TSEM), an independent specialty foundry announced that it began manufacturing of a number of CMOS image sensor (CIS) products for Vision Integration Technology, Inc. (ViTi) in its Fab1 manufacturing facility.
HyperTransport Technology Developers Conference
Providing a forum for its members to learn more about the industry’s highest performance interconnect technology, the HyperTransport(TM) Technology Consortium announced its annual HyperTransport Technology Developers Conference will take place on Thursday, October 18, 2007, at the Santa Clara Marriott Hotel in Santa Clara, Calif. At the conference, commercial and academic members will present information on innovative and enabling HyperTransport solutions, while Consortium executive management will update attendees on HyperTransport technology progress and business opportunities.
Genesys Testware Debuts ArraytestMaker Diagnostics for Embedded Memories
Genesys Testware announced the general availability of ArraytestMaker(TM) Diagnostics – a software tool for automated batch-mode diagnosis and characterization of embedded memories. Automated diagnosis and characterization of embedded memories is essential for improving time-to-volume of system integrated circuits (IC) manufactured using processes with 65nm and finer geometries. Unlike competing solutions, ArraytestMaker Diagnostics works with any Automatic Test Equipment (ATE) without any hardware or software modification. Batch-mode operation simplifies test data management with globally distributed manufacturing test facilities. In contrast to other solutions, ArraytestMaker Diagnostics does not require any change in existing design flows because it works with any Test Access Port (TAP) controller.
Embedded Ethernet Applications Play Key Role in 10GE Technology
While Ethernet semiconductor vendors will continue to reap benefits from existing fast Ethernet (FE) and gigabit Ethernet (GE) product lines during the 2007-2012 forecast period, the more attractive opportunity lies in the embedded Ethernet applications segment, particularly blade switching and storage networking. With a worldwide CAGR of 6.3% through 2011, this segment will encourage the long-awaited adoption of 10GE technology and provide additional, more robust revenue streams.
Freescale Sponsors Embedded Systems Lab at Rochester Institute of Technology
The newly opened multi-million dollar addition to the James E. Gleason Building of the Kate Gleason College of Engineering at Rochester Institute of Technology (RIT) now includes an Embedded Systems Laboratory donated by Freescale Semiconductor. The new laboratory provides equipment and supplies for students to develop hardware and software for microprocessor/microcontroller systems internal to portable, robotic, communication or other embedded systems.
Microcross Rolls Out GX-Linux Platform for CSB735 i.MX21 DevKit
Microcross, Inc. releases a GX-Linux(TM) platform for the Cogent CSB737 with Freescale’s i.MX21 that is already shipping from Cogent Computer Systems. The i.MX21 target processor runs at either 266 or 350 MHz and is designed for low-power, low-cost, high performance products for multimedia applications, including portable devices such as cell phones, digital cameras, MP3 players, medical devices, industrial controls, kiosks, etc.
IMEC to Install ASML EUV Pre-production Tool
IMEC reached agreement with ASML to install an ASML EUV pre-production tool in IMEC’s 300mm facility in 2010. This will enable IMEC and its partners to do research on 22nm CMOS on the world’s most advanced lithography system.
Embedded Computing Vendors Create COM Express Base Board Design Guide
Kontron announces that an impressive line up of companies have come together to create the COM Express Base Board Design Guide. This is a joint effort to ensure the optimal interchangeability of COM Express based Computer-On-Modules. Along with Kontron, Aaeon, Adlink, Advantech, Congatec, Continuous Computing, Curtiss Wright, Diversified Technology, Foxconn, IEI, NMS, Nokia Siemens Networks, PICMG Japan, RadiSys, Trenton Technology and VIA Tech have formed the PICMG COM Express Subcommittee. The Base Board Design Guide is scheduled to be published at the Embedded World 2008 trade show in Nuremberg, February 26-28, 2008.
SMIC Holds Technology Symposium in Beijing
Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI and HKSE: 981) held its technology symposium in Beijing on October 17, 2007, attracting approximately 300 customers, design services providers, technology partners, and vendors.