NEC Expands Use of LogicVision Embedded Test Solutions for SoC Design
LogicVision, Inc. (Nasdaq: LGVN), a leading provider of semiconductor test and yield learning solutions, announced that NEC Electronics is expanding the use of LogicVision’s embedded test solutions to help ensure silicon quality and manufacturability. LogicVision’s embedded logic and memory test solutions have been in use by NEC Electronics for the past two years in Japan, and based on the achieved results, NEC Electronics is now expanding the usage for worldwide adoption across other SoC projects.
Tektronix Debuts New Features for DPO7000, DPO/DSA70000 Oscilloscopes
Tektronix, Inc. (NYSE: TEK), a leading worldwide provider of test, measurement and monitoring instrumentation, announced several new features and enhancements for the award winning DPO7000 Series and the DPO and DSA70000 Series, the highest performing real-time oscilloscopes in the world. The new capabilities provide unimpaired signal representation, as well as accurate timing and amplitude measurements resulting in enhanced productivity, reduced costs, improved efficiencies and increased customer satisfaction. The new capabilities will ease testing of high-speed serial data buses such as PCI-Express, SATA, and HDMI.
Samsung Ships SGH-J750 Mobile Phone with Broadcom BCM59001 PMU SoC
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, announced that its power management unit (PMU) system- on-a-chip (SoC) is now shipping in volume production with one of the leading phone makers in the world. Samsung Electronics has adopted the Broadcom® BCM59001 PMU SoC solution for use in its new SGH-J750 mobile phone, which has begun shipping in volume. The industry leading SoC integration in the BCM59001 PMU delivers both optimized system-level power consumption and lower overall system cost in mobile handsets.
Broadcom, Samsung Expand 3G Cellular Partnership
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, announced that it has expanded its relationship with Samsung Electronics to include advanced 3G cellular solutions for a new series of Samsung mobile handsets that are now available. Broadcom launched its first generation 3G cellular baseband technology with Samsung over a year ago with the SGH-Z220, and the new handsets leverage the companies’ prior joint investment. The new Samsung 3G mobile phones are now shipping to leading cellular operators in multiple countries in Europe, Asia, Africa, Australia and elsewhere.
Apache, Optimal Present IC-Package Co-Design for Power Integrity Webinar
Apache Design Solutions, the technology leader in power signoff and complete silicon integrity platform solutions for system-on-chip (SoC), analog, and system designs, announced that it will partner with Optimal Corporation, a leader in 3D power, signal and thermal integrity analysis for IC Package, System-in-Package (SiP) and PCB design, to present a free online technical webinar that will explore the symmetrical use of package-aware chip analysis and chip-aware package analysis to address true IC-Package co-design.
Analog Devices Creates Precision DACs for Industrial Automation
Analog Devices, Inc. (NYSE: ADI), a world leader in semiconductors for signal processing applications, introduced new precision digital-to-analog converters (DACs) that significantly improve the reliability of industrial process control applications in harsh factory environments, including those operating under extreme temperatures or high compliance voltages. The offering includes four 12-bit to 16-bit single-channel DACs that integrate user-programmable current source and voltage output, making them ideally suited for factory process control, distributed control, and smart transmitter systems. By eliminating the need for bulky discrete analog circuitry and mechanical pin-strapped configurations, the DACs reduce board space by as much as 70 percent compared to competing solutions, enabling system design engineers to deliver more cost- and space-efficient industrial equipment.
SiConnect Announces CEPCA-UPA-SiConnect Proposal for IEEE Powerline
SiConnect, the leader in multimedia-ready home networking, has successfully merged its submission for the forthcoming IEEE P1901 powerline communication coexistence standard with the proposal submitted jointly by the Consumer Electronics Powerline Communication Alliance (CEPCA) and the Universal Powerline Association (UPA).
SOI Industry Consortium Forms to Speed Silicon-On-Insulator Innovation
A group of leading companies throughout the electronics industry announced the launching of the SOI Industry Consortium, aimed at accelerating silicon-on-insulator (SOI) innovation into broad markets by promoting the benefits of SOI technology and reducing the barriers to adoption.
Actel IGLOO FPGA Wins Portable Design China Readers Survey Award
Recognized as the lowest power programmable logic solution in the industry, Actel Corporation announced that its 5µW IGLOO(TM) field-programmable gate array (FPGA) family has won a leading product award in the 2007 Portable Design China Reader Survey Awards. Selected in the “Power Consumption” category, IGLOO was chosen among 14 participating products — spanning traditional microcontroller, system-on-chip (SoC) and programmable logic products — as the lowest power solution. The awards were announced this month after a comprehensive survey conducted by Portable Design China.
Alereon Receives WiMedia Certification for AL5000 Ultra Wideband Platform
Alereon, Inc., the Ultra Wideband (UWB) technology leader for WiMedia and Certified Wireless USB applications, announced the WiMedia Alliance® certification of Alereon’s AL5000 platform as one of the first silicon products certified on WiMedia’s Ultra Wideband (UWB) Common Radio Platform.
Innovative Silicon Becomes Founding Member of SOI Industry Consortium
Innovative Silicon Inc.(ISi), the developer of Z-RAM® high-density memory intellectual property (IP), announced it is a founding member of the newly formed SOI Industry Consortium, that is poised to accelerate the broad adoption of silicon-on-insulator (SOI) semiconductor technology.
Army Selects Quantum3D Thermite Tactical Visual Computer
Quantum3D®, Inc., a leading provider of Commercial off-the-Shelf (COTS), open-architecture, realtime visual computing solutions, at the Association of U.S. Army (AUSA) 2007 Annual Conference, announced that the Thermite® Tactical Visual Computer (TVC) was selected by the U.S. Army Natick Soldier Research Development and Engineering Command to support the Army’s Future Force Warrior (FFW) Increment 2.