Avago Technologies Creates Ultra-Compact Input Device
Avago Technologies, a leading supplier of analog interface components for communications, industrial and consumer applications, announced a thin ultra-compact innovative input device solution that combines a navigation pad module with a motion sense and interface integrated circuit (IC) to provide a mouse-like pointing solution for use in a variety of mobile devices. Typical applications include mobile phones, ultra-miniature PCs, digital still cameras, computer peripheral and other handheld and gaming applications. With a low profile height of 1.7 mm and diameter of 14 mm, this new ultra-compact navigation pad from Avago incorporates a self centering button with click function. Based on embedded capacitive sense technology, this miniature input module will enable designers to develop input devices for mobile devices that can greatly enhance the user’s experience by providing analog cursor control for web browsing, gaming or digital camera applications.
Actel Presents at ARM Developers, Portable Design Conference
Acknowledging the unique power challenges facing today’s designers, Actel will present several sessions at both the ARM Developers Conference and the Portable Design Conference being held this week at the Santa Clara Convention Center.
Agilent Expands High-Definition Multimedia Interface Test Platform
Agilent Technologies Inc. (NYSE: A) announced expanded solutions for its High-Definition Multimedia Interface (HDMI) test platform that are designed to reduce development costs and provide accurate test results. The solutions address four sectors: source testing, sink testing, media physical layer evaluation and protocol test.
Toshiba Unveils Ultra-Compact Camera Modules with Dynastron Image Sensor
Toshiba America Electronic Components, Inc. (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, announced sample availability for a new line of ultra-compact camera modules featuring its Dynastron image sensor technology. This new family of camera modules, which include the TCM9200MD, TCM9100MD and the TCM9000MD, were developed using Toshiba’s chip scale camera module (CSCM) manufacturing technology and are the first to use through chip via (TCV) technology. CSCM allows the mounting and assembly of camera module components in the semiconductor wafer during the module’s manufacture. This delivers an approximate 64 percent reduction in module size in comparison to other modules using the same sensor, a significant benefit for camera phones and laptop computers with challenging design footprint requirements.
IBTA Announces Compliance and Interoperability Plugfest
The InfiniBand(SM) Trade Association (IBTA) announced its 12th Compliance and Interoperability Plugfest, taking place October 1-3 in Durham, New Hampshire. The event provides an opportunity for InfiniBand(TM) device and cable vendors to test their products for compliance with the InfiniBand architecture specification as well as interoperability with other InfiniBand products. Testing will be conducted at the University of New Hampshire’s Interoperability Lab.
Xcerion Rolls Out XML Internet Operating System Beta Program
Xcerion, the Swedish company behind the revolutionary XML Internet OS, the world’s next operating system has after 6 years in “stealth mode” officially announced the Beta launch.
OKI, System Fabrication Technologies Team on System-in-Silicon
Oki Electric Industry Co., Ltd. (TOKYO:6703) and System Fabrication Technologies Inc.(SFT) announced their agreement to begin volume production of System-in-Silicon®, the next generation architecture with SFT’s SISRAM® memory.
Agilent Debuts HDMI TMDS Signal Generator Platform for High Speed Testing
Agilent Technologies Inc. (NYSE:A) introduced an HDMI Transition-Minimized Differential Signaling (TMDS) signal generator platform that enables HDMI high-speed device testing up to 7 Gb/s. The platform can be used for economical research and development, in-depth chip characterization and Authorized Test Center-based compliance pass/fail testing.
Carbon Design Systems Launches Carbon Model Studio
Carbon Design Systems(TM) announced availability of Carbon Model Studio, a solution for the automatic generation, validation and implementation of hardware-accurate software models, enabling a design team to begin software development and debug before silicon.
Embedded MATLAB Subset Automatically Generates Embeddable C Code
The MathWorks introduced the Embedded MATLAB(TM) subset of the industry-leading MATLAB® technical computing language. The Embedded MATLAB subset enables MATLAB users to generate highly efficient, embeddable C code directly from MATLAB programs, avoiding the common, time-consuming and error-prone process of rewriting MATLAB algorithms in C.
ArcSoft TotalMedia Mobile Integrates with NXP Nexperia Cellular System
ArcSoft, Inc. announced that ArcSoft TotalMedia(TM) Mobile multimedia software applications have been integrated in NXP’s Nexperia cellular system solution 5210 family for 2.5G/2.75G cellular feature phones. ArcSoft is widely recognized for its ability to deliver innovative, feature-rich multimedia software solutions to mobile phones, and is an official partner and selected software vendor for NXP’s 2.5G/2.75G cellular solutions. The TotalMedia Mobile solution for NXP’s Nexperia cellular system solution 5210 series includes a photo organizer/viewer, camera, camcorder, photo editor, video editor, and multimedia player.
SPS/IPC/DRIVES Features Korenix’s Industrial Total Solutions
The SPS/IPC/DRIVES is the exhibition for electric automation technology. Korenix Technology Corp., a leading industrial computing manufacturer, will be featured in the booths of their regional distributors at Hall 9, No.548 in the SPS/IPC/DRIVES 2007, which will be held from November 27 to 29.
Altos, Cadence Qualify 45nm, 65nm Statistical Static Timing Models
Altos Design Automation Inc. and Cadence Design Systems, Inc. announced that they have qualified 45nm and 65nm statistical static timing analysis (SSTA) models generated by Altos Variety(tm) in S-ECSM format for use with the new statistical timing analysis technology in the Cadence® Encounter® Timing System and SoC Encounter(TM) RTL to GDSII system.