DapTechnology Introduces FireLink Extended 1394b Link Layer IP Core
DapTechnology, a world-leading supplier of advanced IEEE 1394 technology solutions to the aerospace, defense, industrial, automotive and consumer electronics markets, announced the availability of the FireLink Extended 1394b Link Layer IP Core product. FireLink, implemented in industry-standard VHDL code, is available initially for Xilinx FPGA devices and soon for Altera. The product is targeted at applications requiring up to 800 Mbits/Sec of bandwidth and embedded designs requiring a high performance general purpose IEEE 1394b Link Layer Controller.
Temento Systems Opens Office in San Jose
Temento Systems(R) SA announced it has established a California office in San Jose, serving the North American market. Temento is a leading provider of EDA tools for on-chip design verification. Founded 12 years ago, Temento experienced rapid business expansion in Europe and in Asia, especially in Japan. Following sustained traction for its Dialite product line that targets FPGA designers requiring advanced verification capability, both the market and the product are now more mature to deploy operations in North America. Since design closure continues to challenge design teams, FPGA prototyping remains the mainstay to functionally validate a design running at-speed.
GeoVision Selects TI DSP for License Plate Recognition Solution
GeoVision Incorporated announced the collaboration with Texas Instruments Incorporated (TI) (NYSE: TXN), a leading solution provider of digital signal processing (DSPs) solutions and analog technology, in the development of license plate recognition technology or outdoor surveillance solutions. By adding TI’s TMS320DM6446 processor based on DaVinci technology to an already highly sophisticated GV-series product line, GeoVision can provide an even more comprehensive surveillance solution by adding more value-added features to its worldwide customers and fulfill the needs of customers who require outdoor installations. GeoVision and TI will initially focus on an integrated DSP-based surveillance solution for the license plate recognition/automatic number plate recognition (LPR/ANPR).
IBM Foundry Services Expands Arrow’s Custom Logic Portfolio
The North American Components (NAC) business of Arrow Electronics, Inc. (NYSE: ARW) announced a new relationship with IBM Global Engineering Solutions to broaden Arrow’s silicon portfolio by coupling Arrow’s custom chip design and logistics capabilities with IBM’s foundry products and services.
Group Forms Wafer Level Chip Scale Package Forum, Creates Board
The WLCSP Forum announced its formation, and named its board. The group’s objectives are to promote the adoption of semiconductor devices using wafer level chip scale packages (WLCSP), to establish industry sponsored “best practices” for their utilization and to establish strategies for migration to finer pitch WLCSP products. The California non profit mutual benefit corporation’s board of directors has representatives from the following companies: Amkor Technology Inc., California Micro Devices Corporation, FlipChip International, LLC, Maxim Integrated Products, Inc., Nokia Corporation, and STMicroelectronics. Kyle Baker, of CMD, will serve as its first Chairman. Richard Haas, also of CMD, was named President.
SST Unveils SST89V54RD 8051 Microcontroller for Mobile Devices
SST (Silicon Storage Technology, Inc.)(Nasdaq: SSTI), a leader in flash memory technology, announced a new addition to the company’s popular SuperFlash-based FlashFlex family of 8-bit, 8051-compatible microcontrollers, the SST89V54RD-33-C-QIF. Leveraging the company’s innovative packaging technology, the new SST89V54RD is available in a 6mm x 6mm WQFN package, making it the smallest 8051-based microcontroller currently on the market. The device’s miniature size and low power consumption are ideal for small form factor mobile applications, such as notebook PCs, MP3 players and GPS systems, as well as home entertainment devices including HDMI products. Additionally, the SST89V54RD supports in-system programming (ISP) and in-application programming (IAP), which provide a variety of benefits to device manufacturers and consumers alike.
Freescale Unveils New PowerQUICC II Pro Processors for Storage Market
Manufacturers of storage and printing equipment for consumer and small/medium business (SMB) markets now can leverage the high performance, exceptional integration and industry-leading security of the newest additions to the PowerQUICC II Pro product line from Freescale Semiconductor.
Jazz Semiconductor Introduces Analog-Intensive Mixed-Signal Initiative
Jazz Semiconductor, a wholly owned subsidiary of Jazz Technologies, Inc. (AMEX:JAZ), announced its Analog-Intensive Mixed-Signal (AIMS) initiative to accelerate its leadership in price/performance and power consumption for specialty CMOS technologies and quicken time-to-revenue for analog-intensive products. Today’s consumer electronics products contain more analog-intensive components and demand an AIMS foundry solution for optimized chip design. Jazz is addressing these market demands by offering modular AIMS technologies including RFCMOS and specialty CMOS technologies such as BiCMOS, SiGe BiCMOS and High Voltage CMOS along with extending its world class design enablement tools to allow complex designs to be achieved quickly and more accurately.
Medical Device Industry Prototypes with DSM Somos Stereolithography
According to the Advanced Medical Technology Association (AdvaMed), the medical device industry grew to nearly $220 billion worldwide by 2006 and is poised to grow by yet another 10% in 2007. In this fast-paced, research-intensive sector, there is an increasing need for rapid prototyping processes and materials that can cost-effectively produce parts with challenging performance requirements including water resistance, electromagnetic interference shielding and sterilizability. For many medical device prototypes, Somos stereolithography (SL) resins are providing an attractive solution.
Chipworks Appoints VPs for Patent, Technical Intelligence Business Units
Chipworks, the leader in reverse engineering and analysis of semiconductors and microelectronic systems announced that in support of corporate expansion they have appointed two industry veterans to lead the Technical and Patent Intelligence business units. The company appointed Mike Thumm, vice president, Patent Intelligence and Gary Tomkins vice president, Technical Intelligence.