VMETRO Adds Xilinx Virtex-5 FPGA Support to Serial FPDP IP Core
VMETRO has expanded the use of its Serial FPDP IP core to support Xilinx(R) Virtex(TM)-5 FPGA-based products utilizing RocketIO(TM) GTP multi-gigabit serial transceivers. The combination of VMETRO’s industry-leading hardware and the sFPDP IP core provides high-performance, highly integrated solutions for both front panel optical and VITA-41 (VXS) backplane interconnects. Application areas for this combined Serial FPDP I/O solution include real-time imaging, signal processing, high-speed data recording and test systems.
STMicroelectronics Rolls Out .13-micron Secure Microcontrollers
STMicroelectronics (NYSE: STM), a leading supplier of smartcard ICs to the financial sector, announced a new family of secure microcontrollers based on a 0.13-micron state-of-the-art process technology, which are intended for banking, loyalty card and other financial applications. This advanced family is based on the new ST23 secure platform, which takes advantage of the most recent improvements in security technology and offers optimized computing power for advanced secure applications.
TI Announces SimpliciTI Network Protocol
Texas Instruments Incorporated (TI) (NYSE: TXN) announced the release of the SimpliciTI(TM) network protocol, a proprietary low-power radio frequency (RF) protocol targeting simple, small RF networks (less than 100 nodes). SimpliciTI network protocol was designed for easy implementation with minimal microcontroller resource requirements. The protocol runs out-of-the-box on TI’s MSP430 ultra-low-power microcontrollers and CC110x/CC2500 RF transceivers. The next release of SimpliciTI will also support TI’s CCxx10 System-on-Chips (SoCs).
Kontron Unveils KEEX-4000 3.5-inch SBC with PCI-104 Interface
Kontron, the leading Embedded Computing Technology provider, is proud to release its latest 3.5-inch embedded computing platform, the KEEX-4000. This compact SBC supports low voltage Intel(R) Pentium(R) M and ultra low voltage Intel(R) Celeron(R) M processors with the Intel(R) 852GM/ICH4 chipset. The low power design allows the KEEX-4000 to run fanless, reducing noise and increasing system reliability. With its extremely small footprint, the KEEX-4000 is ideal for a broad range of embedded applications requiring high performance and low power consumption.
AXIOMTEK Introduces MPC170-831-FL Medical Grade Panel Computer
AXIOMTEK, a leading supplier of applied computing platforms for advanced communication, industrial and panel computer applications, is proud to introduce a high performance fanless 17″ medical grade panel computer, MPC170-831-FL. It has got ahead of similar products in the market and has plenty advantages include streamline mechanical design, super slim thickness, core 2 duo technology, fanless and waterproof design, large size and high brightness SXGA LCD, and noiseless operation. The built-in 1.3 mega pixels camera and microphone/speakers provide a most complete solution for VoIP and remote monitoring / telemedicine healthcare terminal. The MPC170-831-FL is suitable for POC (Point of Care), excellent HMI (Human Machine Interface) for medical equipments and remote monitoring / health care terminals (Telemedicine) and more.
NEC LCD Technologies Launches 2 TFT White LED Backlight Modules
NEC LCD Technologies introduced two new 6.5-inch (17cm-diagonal) amorphous-silicon thin-film-transistor (TFT) liquid crystal display (LCD) modules with high luminance and video graphics array (VGA) resolution. The modules, part number NL6448BC20-21C and NL6448BC20-21D, eliminate the need for an inverter circuit by employing white light emitting diodes (LEDs) for the backlight system, instead of the cold-cathode fluorescent lamps (CCFLs) that are traditionally used.
ADLINK, congatec, MSC Form PICMG COM Express Plug-and-Play Subcommittee
ADLINK Technology Inc., congatec AG, and MSC, have joined together to form a new PICMG COM Express plug and play subcommittee. The to-be-released COM Express Plug and Play Design Guide aims to increase the use of COM Express modules by defining a set of carrier design guidelines that enable plug-and-play support and increase compatibility between COM Express modules from various vendors. Jeff Munch, CTO of ADLINK Technology and Interim Chairman of the new subcommittee, expects this new PICMG carrier board design specification to release in February 2008.
IPextreme Promotes Infineon MLI, MSC Interface Standards Specifications
IPextreme(R) Inc., a semiconductor technology licensing specialist, is promoting valuable Infineon MLI and MSC high-speed serial interface standards by making the specifications openly available. The Multiprocessor Link Interface (MLI) is a fast serial interface for inter-processor communications; enabling heterogeneous parallel processing through just a few pins. Similarly the MicroSecond Channel (MSC) controls power modules such as electric motors, fuel injectors and ignition coils, while minimizing pin count and system cost.
Pulsic Receives Patent for Spine-and-Stitch Routing Technology
Pulsic Limited, the leader in custom design automation for memory, announces that it has been granted a patent by the US Patent Office for its spine-and-stitch routing technology. The patent, “Method of automatic shape-based routing of interconnects in spines for integrated circuit design”, addresses optimising the layout of long aspect ratio nets found in memory design and automates a previously manual process.
Intel Invests in Nascentric, Fast-SPICE
Nascentric, Inc., an Electronic Design Automation (EDA) company focused on providing innovative Fast-SPICE simulation and analysis tools, announced that it has closed a $7.2 million Series C financing, including new investor Intel Capital. Existing investors Austin Ventures, Silverton Partners, Needham Capital and EDA veteran Jim Solomon also participated.
Berkeley Design to Attend IEEE Custom Integrated Circuits Conference
Berkeley Design Automation, Inc., provider of Precision Circuit Analysis(TM) technology for advanced analog and RF integrated circuits, announced that the company will be participating at the 2007 IEEE Custom Integrated Circuits Conference (CICC). Berkeley Design Automation will highlight how its Analog FastSPICE(TM) circuit simulator and RF FastSPICE(TM) periodic analyzer are solving big analog/RF verification problems that would be otherwise impractical or infeasible.
Sealevel Systems Announces SeaI/O W-series Wireless Modules
Borrowing from the well-known creed Earle Foster, VP Sales and Marketing for Sealevel Systems, proclaimed, “Neither obstacles, nor temperatures, nor moving devices to be monitored shall stop new SeaI/O W-series from sending and receiving signals. That’s the advantage of wireless SeaI/O(TM) modules. Many devices that were impractical or impossible to monitor with traditional cable solutions can now be monitored with Sealevel’s wireless SeaI/O modules.”
WiMAX to Impact Cellular M2M Market
The cellular M2M market will be impacted by the growing momentum behind the deployment of WiMAX as a next-generation WWAN communications technology. WiMAX is even more spectrally efficient and cost-effective to operate in carrier networks when compared with W-CDMA and CDMA EV-DO, making WiMAX very suitable for low data rate, low ARPU M2M applications — when and where WiMAX connectivity is available.