SEMI Reports July Book-to-Bill Ratio of 0.84
North American-based manufacturers of semiconductor equipment posted $1.44 billion in orders in July 2007 (three-month average basis) and a book-to-bill ratio of 0.84 according to the July 2007 Book-to-Bill Report published by SEMI. A book-to-bill of 0.84 means that $84 worth of orders were received for every $100 of product billed for the month.
Cadence Acquires Clear Shape Technologies
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced that it has acquired Clear Shape Technologies, Inc., an innovative design for manufacturing (DFM) technology company specializing in design-side solutions to minimize yield loss for advanced semiconductor integrated circuits (ICs). Combined with Cadence’s existing DFM methodologies and capabilities, the acquisition uniquely positions Cadence(R) as the only EDA company that can deliver manufacturing awareness and lithographic correctness for all layers in an IC from transistor through interconnect, in designs ranging from SoCs to full-custom and all design domains including analog, digital and mixed signal.
Fairchild Semiconductor Rolls Out High-Efficiency N-channel MOSFETs
Fairchild Semiconductor introduces a new series of high-efficiency N-channel MOSFETs that boast up to 8kV ESD (HBM) voltage protection — 90 percent higher than existing devices on the market. The FDS881XNZ series support the latest architectures for battery pack protection applications such as notebook and cell phones. Utilizing Fairchild’s Power Trench(R) process, these low-RDS(ON) MOSFETs, including the FDS8812NZ with RDS(ON) of less than 5mOhms, reduce conduction losses and extend valuable battery life. They also provide rugged and robust avalanche and high peak current capability to ensure system safety by surviving unexpected voltage spikes that may afflict battery packs.
Empower Debuts LEOs Development Kit for TI DaVinci Dual-Core Embedded CPU
Empower Technologies (TSX.V: EPT) is pleased to announce the launch of the latest LEOs Development Kit for Texas Instruments’ (TI) DM6446 “DaVinci(TM) Technology” dual-core embedded CPU – LDK6446. DM6446 is a DaVinci(TM) Processor which forms part of TI’s DaVinci(TM) Technology ecosystem. The technology includes the following elements: DaVinci Software, DaVinci Development Tools/Kits, and DaVinci Support. This is the first time Empower launched a new embedded CPU platform for LEOs operating software since August 2005 when it first announced the introduction of its LDK591x – LEOs Development Kit for TI’s OMAP591x embedded CPU platform.
Tundra Acquires Smart Interconnect Product for $15.4 Million
Tundra Semiconductor Corporation (TSX:TUN), a leader in System Interconnect, signed an agreement to acquire a new product from a leading global solutions and engineering services provider. The agreement is a significant first step in executing Tundra’s previously announced smart interconnect solutions strategy. This product represents a new product line and new market opportunity for Tundra. Based on strong I/O management experience, Tundra intends to use its existing design teams to develop future products in this new product line and in the broader smart interconnect solutions product portfolio.
Mistral Announces Program for Windows Embedded CE 6.0
Mistral Solutions, a leading product realization company specializing in real-time embedded solutions, announced the availability of its Accelerator Program for Windows(R) Embedded CE 6.0 for use with Texas Instruments Incorporated’s (TI) DaVinci(TM) technology.