Toumaz Technology Succeeds with Cadence Virtuoso Multi-Mode Simulation
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced that Toumaz Technology Limited has successfully used the Cadence(R) Virtuoso(R) AMS Designer Simulator, a component of Virtuoso Multi-Mode Simulation, for mixed-signal simulation in the verification of its latest device. Toumaz, a developer of advanced RF, analog and mixed-signal semiconductors, designs and manufactures Sensium, an ultra low power sensor interface and transceiver platform for a wide range of healthcare and lifestyle management applications.
Mentor Graphics Announces CHS Product Version 2007.1
Mentor Graphics Corporation (Nasdaq: MENT) announced availability of the latest release of the CHS[TM] product suite, version 2007.1. CHS is Mentor’s flagship product supporting vehicle electrical system design and wire harness engineering. Along with enhanced performance, CHS version 2007.1 focuses particularly on providing enhanced user experience.
Solido Integrates Statistical Design, Verification with Cadence Virtuoso
Solido Design Automation announced the integration of its new transistor-level statistical design and verification technology with Cadence(R) Design System, Inc.’s Virtuoso(R) Analog Design Environment and Virtuoso Spectre(R) Circuit Simulator. Customers who design analog/mixed-signal, custom digital, and memory integrated circuits (ICs) will benefit from the integration of Solido technology by improving IC yield and eliminating the need to over-design circuits. In addition, designer productivity is expected to soar due to the tightly integrated and complementary products.
Lightspeed Introduces Logic’s Reconfigurable Logic IP for 65nm, 45nm
Lightspeed Logic, the leading provider of mask reconfigurable IP, announced a new generation of Lightspeed Logic’s Reconfigurable Logic IP for the 65nm and 45nm process nodes. In addition to providing increased flexibility in chip architecture, significant reduction in design cost and rapid time-to-market, the new Manufacturability-Optimized Reconfigurable Logic brings significant benefits to customers designing in advanced geometries. Because of the regularity provided by the tiling structure and the full knowledge of the immediate neighborhood of the tile, Lightspeed Logic, in partnership with its customers, can fully deploy OPC/RET technologies without facing the typical computing limitations associated with standard cell structures. As a result both lithography-related variability and stress-related variability are substantially reduced and the timing modeling does not need to accommodate overly pessimistic guardbanding.
INTER ACTION Invests in Teseda
Teseda Corporation, leading providers of comprehensive scan based diagnostic and debug solutions for high yield silicon production, are pleased to announce a $1.2 million strategic investment from INTER ACTION Corporation in Japan. “This new funding allows us to continue developing new products to improve yields and time to market,” said Armagan Akar, CEO of Teseda. “Our first two quarters in FY07 have been a significant delivery period for products and continued customer satisfaction.”
IBASE Launches FWA6204 Entry-level Network Security Appliance
IBASE Technology, a leading manufacturer of industrial PCs, communication appliances and DVRs, introduces its latest flexible entry-level network security appliance – FWA6204. The FWA6204 is a robust 1U rackmount communications appliance built with four Intel(R) Gigabit Ethernet controllers for fast connectivity.
Faraday, Sequence Partner for Integrated Low Power Design Flow
Sequence Design, the EDA leader in Design For Power (DFP) SoC design solutions, announced that it has partnered with Faraday Technology Corporation to deliver an advanced low power design flow to Faraday’s ASIC design customers. The flow encompasses Sequence power analysis, estimation, debug and reduction tools. Faraday, a leading SoC ASIC vendor, is the newest member of the In-Sequence partnership program.
CSR, Freescale Team on Wireless Connectivity for Consumer Devices
CSR (LSE:CSR) announced the company is cooperating with Freescale Semiconductor on bringing wireless connectivity to a number of Freescale’s mobile and home consumer reference designs and development kits. CSR’s BlueCore4-ROM chip will provide Bluetooth connectivity for Freescale’s i.MXS development kit. The i.MXS development kit has been developed around the fast-growing i.MX multimedia applications processors portfolio and has been created to assist OEM and ODMs by helping to reduce development costs and speed time to market. i.MX applications processors have already been used in many diverse applications in the consumer space including MP3 players and portable navigation devices.
DapTechnology Debuts Mil1394b OHCI PMC Host Adapter for SAE AS5643-1
DapTechnology, a world-leading supplier of advanced IEEE1394 protocol analyzers & solutions to the aerospace, defense, industrial, automotive and consumer electronics markets announced the immediate availability of their Mil1394b 3-channel OHCI PMC host adapter. The Mil1394b OHCI PMC host adapter, which addresses a growing need for multi-channel transformer coupled bus interfaces, is used primarily in mission critical aerospace and defense applications requiring longer media distances respecting the SAE AS5643-1 standard.
Cypress Unveils Powerful PSoC CapSense Touch Screen Solution
Cypress Semiconductor Corp. (NYSE:CY) announced the industry’s most flexible touch screen controller solution, addressing a growing trend toward touch screen technology in products from mobile handsets to white goods. Cypress’s PSoC(R) CapSense[TM] capability supports projected capacitance and surface capacitance technologies across a broad range of screen sizes and types. The new solution takes advantage of the flexible PSoC mixed-signal array architecture to deliver high-accuracy touch screen performance that is ideal for small screen portable devices including mobile handsets, smartphones, and portable media players, as well as for larger screens required by applications such as games, POS terminals, and white goods.
Wind River Introduces On-Chip Debugging for Manufacturing and Test
Wind River Systems, Inc. (NASDAQ: WIND), the global leader in Device Software Optimization (DSO), announced the immediate availability of Wind River On-Chip Debugging for Manufacturing and Test, an innovative standards-based offering that allows test and manufacturing engineers the ability to diagnose hardware problems on the manufacturing floor. This robust new solution enables manufacturing organizations to increase production line throughput, validate and verify finished products more effectively, reduce scrap and rework, and easily create custom test applications for their individual needs. Furthermore, On-Chip Debugging for Manufacturing and Test complements and extends an organization’s existing investment in tools such as boundary scanners, logics analyzers and oscilloscopes.