EDA News – 2007.07.16

ABI Research Publishes Report on Mobile WiMAX in the United States
Just a little over a year ago, most people thought the United States would only see deployments of fixed WiMAX in rural areas with no DSL or cable modem service. During the summer of 2006, however, those who did not see the bigger picture got a reality-check. In July, Clearwire made a firm commitment to shift its proprietary network to mobile WiMAX, receiving investments from Intel and Motorola. Shortly afterwards, Sprint Nextel announced its plans to deploy mobile WiMAX to make use of its extensive 2.5 GHz spectrum, becoming the first major mobile operator to commit to WiMAX.

ASML Launches TWINSCAN XT:1000 KrF Lithography System
ASML Holding NV (ASML) announced a new KrF lithography system that significantly reduces operating costs for its customers. The ASML TWINSCAN[TM] XT:1000 scanner extends cost efficient KrF technology to resolutions that previously required more expensive ArF technology. Customers can realize savings of 30 percent or more per layer as a result of lower operating costs for KrF technology, particularly from cheaper lasers and lower materials cost such as KrF resists.

BAE Systems to Create FPGA for Space
BAE Systems will produce and sell radiation-hardened field-programmable gate array (FPGA) semiconductors for space use, responding to a critical customer need for the devices. Under a license agreement with Actel Corp., the company will manufacture FPGAs that were discontinued in 2006. The agreement solves a major obsolescence problem for many legacy satellite programs, enabling producers of satellite payloads and instruments to avoid time-consuming and costly redesigns.

IMEC Expands 3D Packaging Research Program
IMEC expands its 3D packaging research program to fully exploit the potential of novel 3D technologies. Besides 3D interconnection technologies developments, the program is extended with research on system design methodologies. Both the technology and design sub-programs will be based on actual system requirements and closely coupled.

Amkor, IMEC to Develop Cost-effective, 3D Wafer-level Technology
Amkor Technology, Inc. (Nasdaq: AMKR), a world-leading provider of advanced semiconductor assembly and test services, and IMEC, Europe’s leading independent nanoelectronics and nanotechnology research center based in Belgium, announced that they have entered into a 2-year collaboration agreement to develop cost-effective, 3D integration technology based on wafer-level processing techniques.

IMEC Reports on 32nm Lithography
One year after shifting the objective of its lithography program to the 32nm half pitch node, IMEC reports progress on high-index 193nm immersion lithography, double-patterning schemes for 193nm water-based immersion lithography and extreme UV (EUV) lithography.

free Electronic Products

Scanimetrics Debuts Wi-TAP Non-contact, Virtual Probe for SiP Testing
Scanimetrics, Inc., a start-up company that helps enable Moore’s Law for nanoscale devices, officially debuted with the launch of its first product in the semiconductor test market, a revolutionary non-contact, “virtual probe” testing technology for the semiconductor industry. Since its founding in 2003, the Edmonton, Alberta-based company has been developing unique, RF-based technology, enabling chipmakers to both improve the performance of their devices and cut manufacturing costs up to 50 percent.

New Developments in Real-Time Linux Webinar
MontaVista(R) Software, Inc., the leading provider of Linux(R) for intelligent devices and communications infrastructure, will present a free educational webinar examining the latest dramatic developments in the real-time capabilities of embedded Linux. Information and registration for the session is available online. The event is scheduled for Wednesday, July 25, at 10:30 a.m. U.S. Pacific Time or 1:30 p.m. U.S. Eastern Time.

Microchip Rolls Out 16V, 250 mA MCP1703 Low Dropout Regulator
Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, announced the MCP1703 Low Dropout Regulator (LDO)-a 250 mA LDO with low quiescent current, high input voltage, over-voltage protection and thermal shutdown on a single chip. The new LDO is available in a 3-pin SOT-223 and other packages, and is ideal for applications requiring long battery run-times and high tolerance for input-voltage variations, such as smoke detectors, fire alarms and thermostats.

Stratix III FPGAs in Compliance with JESD79-3 JEDEC DDR3 SDRAM Standard
Altera Corporation (NASDAQ: ALTR) announced the FPGA industry’s first full-compliance support for high-performance DDR3 memory interfaces. Under the newly ratified JESD79-3 JEDEC DDR3 SDRAM Standard, Altera’s Stratix(R) III family of FPGAs provides designers with the high-performance and low-power benefits of DDR3 memory that are becoming increasingly critical for a wide range of communications, computing and video processing applications.

Xilinx to Attend IEEE Nuclear and Space Radiation Effects Conference
Xilinx, Inc. (NASDAQ:XLNX) announced that its industry-leading programmable logic solutions for enabling space applications, will be showcased at the 2007 IEEE Nuclear and Space Radiation Effects Conference (NSREC) , July 23-27, 2007 in Honolulu, Hawaii. Xilinx in-booth demonstration and technology presentations are available for show registered attendees throughout the conference.

Synopsys Acquires Semiconductor IP Assets of MOSAID Technologies
Synopsys, Inc. (NASDAQ: SNPS), a world leader in semiconductor design software, announced it has signed a definitive agreement to acquire the semiconductor IP assets of MOSAID Technologies Inc. (TSX: MSD), a developer and licensor of semiconductor intellectual property. Synopsys plans to integrate such assets, consisting primarily of MOSAID’s double data rate (DDR) memory controller and PHY semiconductor IP products, into its DesignWare(R) IP portfolio. The purchase will further increase the breadth of Synopsys’ offerings in standards-based connectivity IP. The purchase price for the acquisition is approximately $15 million, payable in cash. The transaction is subject to customary closing conditions and is expected to close in August 2007.