AnalogicTech Unveils USB/AC Battery Charger ICs for Portable Systems
Advanced Analogic Technologies Incorporated (AnalogicTech) (Nasdaq: AATI), a developer of power management semiconductors for mobile consumer electronic devices, announced a comprehensive line of USB/AC battery charger ICs for portable systems operating off single-cell 4.2V (4.375V) Lithium Ion/Polymer batteries. Integrating a wide array of features into a highly compact footprint and requiring just a single external component, these new devices offer complete USB/AC charging function in packages as small as 2.0 x 2.1 mm.
Texas Instruments Rolls Out ISO722x Dual-Channel Digital Isolators
Utilizing the company’s innovative capacitive isolation technology, Texas Instruments Incorporated (TI) (NYSE: TXN) introduced a new family of dual-channel digital isolators, featuring faster data transmission, higher magnetic immunity and longer life expectancy than competitive devices. The ISO7220 and ISO7221 improve system performance and reduce cost in high-voltage, noisy applications such as factory automation, process control, computer peripherals and data acquisition systems.
EMA Design Automation Offers SymXpert for Symbol Creation Process
EMA Design Automation(TM), a full-service provider of Electronic Design Automation (EDA) solutions, announced that it will now offer SymXpert(TM) from Perception Software to its customers. “Our goal is to provide as much automation to the design process as possible,” said Manny Marcano, President and CEO of EMA. “Symbol creation is one of those areas that has been a 100% manual process, until now.”
KOA Speer Electronics Introduces WK73 Wide Terminal Flat Chip Resistor
KOA Speer Electronics introduces the WK73 wide terminal flat chip resistor providing high reliability and performance. This new flat chip resistor features higher power ratings as a result of its enhanced heat dissipation, as demonstrated by the WK73S3A type (1225 size) with a 1.5W rating vs. KOA Speer’s RK73B3A type (2512 size) with a 1W rating. The WK73 offers current sensing for power supply circuits, which makes it ideal for automotive electronics, ECU’s, anti-locking braking systems and air bag systems.
Spectrum Control Announces EMI Filtered Strip Terminal Blocks
Spectrum Control, Inc. has designed a custom EMI filtered barrier strip terminal block with pre-bent leads to allow for easier installation on printed circuit boards (PCBs). This bent lead design was created for fast and easy installation, as PCBs are parallel to the housing bottom of the block. These new terminal blocks are appropriate for filtering power supplies in telecommunications equipment, metering, instrumentation, EDP equipment and industrial controls.
Gleichmann Sees NEC Starter Kit for 78K0/Lx3 Microcontroller
Gleichmann Electronics announces the availability of NEC Electronics’ See it! starter kit, which supports the recently launched 78K0/Lx3 8-bit microcontroller family. Version 1.1 supports devices without A/D converter as well as versions with 10-bit A/D converter.
IEC, British Telecom Brainstorm on 21st Century Communications
The International Engineering Consortium (IEC) and Host Sponsor British Telecom (BT) led the industry last week in brainstorming educational content for the IEC’s 21st Century Communications World Forum. Themed an “Innovation Imperative,” the 21st Century Communications World Forum planning meeting took place with 75 leading telecommunications industry professionals.
Cadence Design Systems Acquires Invarium
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced that it has acquired Invarium, Inc., a San Jose-based developer of advanced lithography-modeling and pattern-synthesis technology. Invarium’s pattern synthesis capabilities enable superior pattern resolution and faster yield ramp for designs targeted to 45-nanometer-and-below process technologies. This acquisition creates the path to the industry’s leading DFM solution for functional and parametric yield improvement, enabling the prevention, detection, correction and optimization of manufacturing effects on advanced geometry designs.
Cadence Integrates SiP Technology into Virtuoso, Encounter
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced that Cadence(R) SiP (system-in-package) technology is now integrated with the latest releases of the Cadence Virtuoso(R) custom design and Cadence Encounter(R) digital IC design platforms, bringing significant new design capabilities and productivity enhancements. Coupled with other Cadence products, including the Cadence RF SiP Methodology Kit, Cadence offers the leading suite of SiP design technology. The new Cadence SiP technology offers an expert-engineering process optimized for automation, integration, reliability, and repeatability. With the advanced SiP technology, Cadence enables designers to converge diverse IC and package-assembly technologies into highly integrated products. This results in designers meeting escalating demands for small, high-performance products while keeping costs low.