TI Drives 7 White LEDs with High-Efficiency Charge Pump
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced today a high-efficiency, constant-frequency charge pump DC/DC converter that uses dual-mode conversion to maximize efficiency over the input voltage range. The tiny 3 mm x 3 mm device provides a fully programmable current with I2C interface for applications, such as cellular phones, PDAs and multi-display handheld devices.
Leading Companies to Address Datalog Bottleneck in Yield Analysis
The STDF Fail Data Standardization Group is holding an open meeting at SEMICON West on July 17 to review progress on the working group’s effort to develop a standard format to enable easy sharing of structural fail information for manufacturing yield analysis. The Group, comprised of representatives from leading automatic test equipment (ATE) and electronic design automation (EDA) providers, along with several of the world’s largest semiconductor manufacturers, was started after meetings initiated by Verigy beginning at SEMICON West in July 2006. It recently added IBM, Texas Instruments and Advantest to its growing list of participating companies. The Group is targeting initial internal test trials of the standard this fall, with a Beta site evaluation program planned for late 2007.
LSI Enables 1.3 Megapixel Camera Functionality for Low Cost Handsets
LSI Corporation (NYSE: LSI) announced two new additions, X112 and X113, to the TrueNTRY(R) mobile phone platform for the low-cost multi-media camera phone mass market segment. The 2 platforms feature integrated camera functionality and yet result in a low cost for GPRS (general packet radio service) mobile handsets, which is currently the largest selling segment of mobile phones. The new TrueNTRY mobile phone platforms support camera resolutions of up to 1.3 Megapixels along with a full range of camera and multimedia features. By integrating camera functionality into low-cost mobile phones, LSI is enabling handset makers to differentiate themselves in the competitive low-cost, mass market and target high-growth countries like India and China where camera-capable cell phones are in high demand.
National Semiconductor Rolls Out Mobile I/O Companions
A new mobile input/output (I/O) companion family from National Semiconductor Corporation (NYSE: NSM) offers designers an easy way to expand system functionality in portable products such as personal digital assistants, media players, instrumentation, medical equipment and mobile handsets.
OCP-IP Supports Cadence’s Assertion Based OCP Protocol Verification IP
The Open Core Protocol International Partnership (OCP-IP), an independent non-profit semiconductor industry consortium, announced their support of Cadence’s Assertion Based Verification IP (ABVIP) for the development and verification of the OCP protocol. OCP’s ascendance as the system architecture “backbone” within increasingly complex consumer and portable designs has driven the need for improved verification at the block, chip and system levels.
VSI Alliance to Close Operations
The VSI Alliance (VSIA), the leading IP standards body for the electronics industry, announced that the Board has voted to close operations and transfer the work of the VSIA to other organizations who develop IP and electronics standards. The VSIA Board will act as a stewardship committee shepherding the donation of VSIA IP standards to other industry organizations, supporting the industry’s goal of consolidating this work.
Atmel Debuts 128K-bit Serial EEPROM in 8-pin Ultra Thin MLP Package
Atmel(R) Corporation (Nasdaq: ATML) announced the industry’s first 128K-bit Serial EEPROM device in an 8-pin ultra thin MLP (2 x 3mm) leadless package with overall height of 0.60mm. The 8-pin ultra thin MLP (2 x 3 x 0.60mm) package is now offered in densities from 1K-bit to 128K-bit for the 2-wire Serial EEPROM (AT24) and 1K-bit to 64K-bit in the SPI Serial EEPROM (AT25) family.
BSQUARE Launches Windows CE DevKit for Marvell PXA3xx Processors
BSQUARE (Nasdaq:BSQR) announced that it is now shipping new development platforms for the Marvell(R) PXA3xx (code named Monahans) family of application processors based on third-generation XScale technology: DevKit PXA300 and DevKit PXA320. A third platform, DevKit PXA310, is expected to ship shortly.
Intel Invests in VMware Virtualization Platform
VMware, Inc., the global leader in software for virtualization solutions announced that Intel Corporation, through its global investment arm, Intel Capital has agreed to become an investor in VMware. VMware’s base virtualization platform virtualizes the Intel architecture. Intel microprocessors comprise the majority of the systems on which VMware’s virtualization products are deployed.
Ikanos Selects Cadence Incisive Palladium Accelerator-Emulator
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced that Ikanos Communications, Inc. (NASDAQ: IKAN) has adopted the Cadence(R) Incisive(R) Palladium(R) series of accelerator/emulators for its advanced system-level verification needs. Ikanos Communications develops chipsets that enable carriers to offer Fiber Fast? bandwidth and high-speed networking processing for enhanced trip play solutions.
Cadence Unveils Logic Design Team Solution for Logical-Physical Closure
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced an innovative solution to the crucial challenge of achieving timing, power, area and schedule predictability in the hand-off of complex semiconductor designs from logic design teams to physical implementation teams. The Cadence(R) Logic Design Team Solution offers a new “design with physical” approach that resolves this conundrum by automatically delivering an accurate physical description of the design into the logic design stage.
Teradici Achieves First-Time Silicon Success with Synopsys
Synopsys, Inc. (NASDAQ: SNPS), a world leader in semiconductor design software, announced that Teradici Corp. has achieved first-time silicon success utilizing Synopsys’ Galaxy(TM) Design Platform products, Discovery(TM) Verification Platform products, DesignWare(R) silicon intellectual property (IP) and Synopsys Professional Services on their first multi-million-gate system-on-chip (SoC). This unique PC-over-IP(TM) SoC technology spans the enterprise network, delivering breakthrough innovation in computer display compression to emulate a true personal computer (PC) experience over internet protocol networks. Synopsys was able to help Teradici deliver the complex SoC quickly, within the tight market window, and achieve silicon success.