NEC Rolls Out M2 3.5G Mobile Handset LSI Chip
NEC Electronics Corporation introduced the M2 system LSI chip that integrates third generation (3G to 3.5G) W-CDMA and HSDPA communications technologies with application functions, with advanced low power technologies optimized for mobile handsets. The chip utilizes a 3.5G digital baseband (DBB) technology developed by Adcore-Tech, the mobile communications joint venture established in August 2006. The M2 chip is part of NEC Electronics’ Medity(TM) series of mobile handset solutions, and is the successor to the “M1″ chip introduced in September 2006, renowned for its best-in-class 700-hour standby time. While the M1 was based on the ARM926EJ-S(TM) CPU core, the M2 chip utilizes the more advanced ARM1176JZF-S(TM) core, delivering a significant improvement in performance.
Microchip Files Infringement Lawsuit Against Shanghai Haier Integrated Circuit
Microchip Technology Inc. (NASDAQ:MCHP) of Chandler, Arizona., a leading provider of microcontroller and analog semiconductors and the world leader in 8-bit microcontrollers, has filed a copyright infringement lawsuit against Shanghai Haier Integrated Circuit Co., Ltd. (SHIC) of Shanghai, China.
Broadcom Details Qualcomm Infringement Case to Administration
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, urged the Administration not to overturn an International Trade Commission (ITC) action against Qualcomm Incorporated (Nasdaq: QCOM) for infringing a Broadcom patent, saying a Presidential veto would weaken U.S. efforts to strengthen intellectual property (I.P.) rights globally.