Iridium Takes First Step in Development of NEXT Satellite Communications
Iridium(R) Satellite announces it has released a Request for Information (RFI) to potential partners interested in participating in the design, development and deployment of “Iridium NEXT,” the company’s next-generation satellite communications network. The Iridium RFI is the company’s first official step toward the procurement of the NEXT system.
Kenet KAD2708-350 Analog-to-Digital Converter Samples at 350 MSPS
Kenet Inc., a developer of revolutionary low-power, analog mixed-signal products, announced the release of a higher-speed member of its 8-bit analog-to-digital converter (ADC) product family. The new part, the KAD2708-350, operates at 350 million samples per second (MSPS). The company is also announcing the addition of CMOS outputs for lower-speed versions of its ADCs, further expanding the product family and broadening the value of the products across numerous applications.
ZTE Uses Mindspeed DS3/E3 LoC in Core Network, Radio Network Controller
Mindspeed Technologies, Inc. (NASDAQ:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, announced that ZTE Corporation, a leading global provider of telecommunications equipment and network solutions, has selected Mindspeed’s two-port DS3/E3 line card-on-a-chip (LoC) for use in ZTE’s Core Network (CN) and Radio Network Controller (RNC) of W-CDMA 3G wireless backhaul platforms. The M29312 LoC integrates two independent DS3/E3 line interface units (LIUs) with framers, ATM/HDLC processors, and telecom application package (TAP) driver software.
Fairchild Semiconductor Creates System-in-a-Package Ballast IC for CFL
Fairchild Semiconductor (NYSE: FCS) introduces the FAN7710, the most highly integrated ballast IC on the market specifically developed for compact fluorescent lamp (CFL) designs. Offering a “system-in-a-package” approach, the FAN7710 optimizes performance while simplifying design and overcoming the space limitations of CFL lighting applications.
picoChip Promotes Femtocell by Joining Femto Forum
picoChip announced that it has joined the Femto Forum, which will support and promote femtocell deployment worldwide. The Forum brings together the foremost femtocell equipment vendors with the major global mobile operators assessing the technology.
eSilicon Introduces ARM-based Peripheral Subsystem Architecture
eSilicon Corporation, a pioneering semiconductor Value Chain Producer (VCP), announced a new ARM(R) processor-based peripheral subsystem architecture. The new subsystem reduces time-to-market for ARM Powered(R) system-on-chip (SoC) solutions by providing developers with several industry-proven, “off-the-shelf” system technologies, enabling them to focus on their application-specific, value-added functions.
Ansoft Unveils High-Performance Design Workshops
Ansoft Corporation (NASDAQ:ANST) announces “First-Pass System Success,” application workshops for high-performance design, to take place from Sept. 12 through Nov. 15 throughout Asia, North America and Europe. During these events, leading technology companies and Ansoft’s technical staff will collaborate to discuss the latest simulation techniques and design methodologies to help engineers achieve first-pass system success when designing high-performance electronic systems.
Agilent Rolls Out USB-Based Sensors for Power Measurements
Agilent Technologies Inc. (NYSE:A) announced the release of the Agilent U2000 Series of USB-based power sensors, which are more affordable and lighter weight than typical power meters and similar power-sensing solutions. Since the sensors operate without power meters or extra hardware modules, they save bench space, and make field work easier and simpler.