Silterra, IMEC Target Foundry-Compatible 65nm CMOS Process
Silterra Malaysia, a leading foundry in Malaysia and IMEC, Europe’s leading independent nanoelectronics and nanotechnology research center based in Belgium, announced that they have signed an agreement for a joint development project (JDP) to create a foundry-compatible 90-nm CMOS process technology with intention to further scale to 65-nm. A 110-nm derivative will also be developed in parallel. This collaborative project is an extension of the JDP conducted earlier for the 0.13-micron (130-nm) technology and which is already in production at Silterra.
Gleichmann Announces Super-Transmissive Natural Light TFT LCD Module
Gleichmann Electronics presents a new 6.5-inch (17 cm diagonal) super-transmissive natural light TFT (ST-NLT)liquid crystal display (LCD) module using a white light emitting diode LED)for backlight.
Polatis to Showcase Optical Switching Technologies at NXTcomm
Polatis Inc., the leading manufacturer of optical switches for the telecoms industry, announced that it would give live demonstrations of two next generation optical switching technologies at NXTcomm 2007, taking place from June 19th – 21st at McCormick Place, Chicago.
Aeroflex Creates 3920 Digital Radio Test Set for TETRA, P25
Aeroflex has announced the introduction of the new 3920 Digital Radio Test Set for TETRA and P25. The 3920 features new enhancements that provide test professionals with more test capabilities integrated into one system, as well as extended analysis range and file management functions. The next generation of the Aeroflex 3900 Series, the 3920 replaces the 3901 and 3902 Radio Test Sets. While providing new features and functions, the 3920 continues to perform all the tests previous capable with the 3901 and 3902, including TETRA Mobile Station, Base Station and Direct Mode test features.
picoChip Authorizes Cambridge Consultants for picoArray Multi-Core DSP
Cambridge Consultants has become the first authorized design centre for picoChip’s multi-core digital signal processor (DSP), picoArray. picoArray devices incorporate arrays of DSP elements, delivering extremely high performance. This makes them ideal for the computationally-intensive tasks involved in advanced wireless signal processing, while also providing adaptability that can be employed to accommodate operational problems such as varying channel conditions, or changes in the service profile of the communications system. The devices are available in forms suitable for both infrastructure and user terminal applications, offering a powerful platform to develop products for emerging global wireless communications markets such as WiMAX and 4G.
Interphase, Surf Enable Multi-Media Delivery on AdvancedTCA, MicroTCA
Interphase Corporation (NASDAQ:INPH), a leading provider of robust building blocks, highly integrated subsystems and innovative gateway appliances for the converged communications network, and Surf Communication Solutions (“Surf”), a leading developer of high-capacity multimedia processing boards for the telecommunication infrastructure market, announced successful integration of I-TDM functionality between the Interphase Advanced Mezzanine Card (“AMC”) iSPAN 3639 communications controller and the Surf AMC DSP multimedia processing farm. This integration enables customers to develop media gateways, media servers and mobile gateway applications for converged networks on AdvancedTCA (“ATCA”), MicroTCA and IBM BladeCenter(R) platforms.
AMI, MagnaChip Team on SmartPower, Ultra-Low-Power Technology
AMI Semiconductor (NASDAQ:AMIS), a leading designer and manufacturer of state-of-the-art mixed-signal and digital products for the automotive, medical and industrial markets, and MagnaChip Semiconductor, a leading designer, developer and manufacturer of mixed-signal and digital multimedia semiconductors, announced that MagnaChip will manufacture AMI Semiconductor’s 0.35-micron SmartPower technology and continue existing joint development of ULP technology. This agreement follows a November 4, 2005 announcement of a 0.18-micron development and foundry relationship between the two companies.
DesignArt Selects Tensilica Xtensa LX2 Cores for WiMAX Baseband Chip
Tensilica(R), Inc. announced that DesignArt Networks, of Ra’anana Israel, has decided to use multiple Xtensa(R) LX2 configurable processor cores to speed product development and reduce risk to their WiMAX wireless baseband chip design. Multiple Xtensa LX2 cores are used in PHY and MAC layers of DesignArt’s SOC platform, where some are replacing RTL state machines with high performance software, and some have been configured as custom DSP engines, handling high-speed signal processing functions.