NHK, ATEME Team on Ultra HD with MPEG-4 AVC
ATEME(TM) SA, an acknowledged leader in MPEG-4 video compression solutions, announced that ATEME’s world-leading encoding technology was selected for use in the first public Ultra HD demonstration with MPEG-4 AVC (H.264) by NHK in Tokyo. The company is cooperating closely with NHK Labs in the design and development of this next-generation standard.
Forte Rolls Out Cynthesizer SystemC 3.3 Synthesis Product
Forte Design Systems announced the availability of version 3.3 of its Cynthesizer(TM) SystemC synthesis product. Cynthesizer v3.3 is the first high-level synthesis product to offer a direct path from high-level SystemC to GDSII by integrating Cynthesizer and Magma Design Automation’s Blast Create(TM) synthesis technology and Blast Fusion(R) place-and-route technology. The latest release also adds SystemC behavioral design IP, a graphical analysis environment, and other features for better quality of results (QoR).
Gleichmann Announces NEC V850FX3-CANIT Starter Kit
NEC Electronics’ V850FX3-CANIT starter kit was specially developed for the V850ES/FX3 series MCUs and enables you to get started quickly with your complex CAN applications. The Evaluation Board, which is available from Gleichmann Electronics, is based on the 100-pin µPD70F3377 with 512 KB flash memory. An on-board USB interface is provided for fast and secure programming as well as efficient on-chip debugging. The board can be provided with an optional, additional 20-pin connector for connection to an NWire debugger e.g. NEC Electronics’ QB-V850MINI-EE.
Design Automation Conference to Feature Automotive Electronics
The Design Automation Conference (DAC), the electronic design automation (EDA) industry’s premier event, will feature a special theme of automotive electronics, focusing on an exciting segment of the electronics industry that is revolutionizing the automobile with a variety of new technologies. The thousands who attend the 44th DAC at the San Diego Convention Center June 4-8 will hear from leading automotive manufacturers and suppliers on the latest trends and issues in automotive electronics, and see first-hand some of the automotive industry’s latest technology advancements. Technical presentations and panel discussions throughout the conference will cover a broad range of theme-related topics ranging from fuel cells to electric drivetrains and advanced entertainment and safety systems.
Infineon Selects DAFCA’s ClearBlue Silicon Validation Suite
DAFCA Incorporated, the leading vendor of on-chip reconfigurable infrastructure and tools for in-system, at-speed silicon validation, announced that Infineon Technologies AG has successfully employed their ClearBlue(TM) Silicon Validation Suite (SVS) in the implementation of a new high-speed serial ATA platform chip. Infineon’s ASIC Design and Security (ADS) business unit successfully inserted the on-chip instrumentation IP and used it, post-silicon, to both validate and optimize their 90nm device.
Celoxica Quantifies FPGA Benefits at AMD Torrenza Initiative Seminar
At the AMD Torrenza Initiative seminar this week, Celoxica (LSE:CXA) presented results of an oil-exploration algorithm customer benchmark, achieving 28x performance improvement on a forward wave migration algorithm. In addition, Celoxica presented a financial analysis that showed a consistent 10x return on capital invested on FPGA-enabled servers, and a 50% increase in return on investment by adding one FPGA acceleration card to each server.
PLDA to Demonstrate PCIe Gen 2 at Design Automation Conference
PLDA, the industry leader in the high-speed bus IP market, announced that it will be demonstrating a complete PCIe Gen 2 solution at the Design Automation Conference (DAC) June 4-7 in San Diego, CA, USA. The PLDA PCIe Gen 2 demo will include a FPGA-based board running PLDA’s PCIe Gen 2 XpressRich IP on a server Platform featuring two quad processors from the industry leading processor manufacturer. This PCIe Gen 2 demo will provide the best look to date at actual throughput numbers – an industry first.
ALi Accelerates Tapeout of Set-Top Box Chip with Synopsys IC Compiler
Synopsys, Inc. (NASDAQ: SNPS), a world leader in semiconductor design software, announced that ALi Corporation, a leading supplier of integrated circuits for digital audio/video applications, has taped out their latest set-top box chip using Synopsys’ IC Compiler next-generation place-and-route solution. Approaching multi-million gates in size, this complex design needed to incorporate a high level of integration at the smallest possible die size, as well as high frequency with acceptable power dissipation. IC Compiler’s advanced optimizations, in particular congestion avoidance during placement, enabled ALi to exceed its performance targets while achieving a superb die utilization rate. These optimizations, coupled with IC Compiler’s tight correlation with sign-off, were also instrumental in providing significantly faster design closure compared to ALi’s previous solution.
Mentor Graphics Announces Serial ATA Physical Layer IP Core
Mentor Graphics Corporation (Nasdaq: MENT), a leader in standards-based semiconductor intellectual property (IP) and fully integrated IP subsystems, announced its new Serial ATA (SATA) physical layer (PHY) IP core. The SATA PHY IP core, targeted for the TSMC 130nm Low Voltage Oxide (LVOD) process, provides a completely integrated solution for both SATA host and device applications running at either 1.5Gbps or 3.0Gbps speeds. The SATA PHY has one of the industry’s smallest footprints based on its efficient analog circuitry design—up to five times smaller than competitive solutions—making it ideal for today’s low-power storage applications and consumer electronics.
Sonics, JEDA Create Validated SystemC Models of SMART Interconnect
Sonics Inc., a premier supplier of system-on-chip (SoC) SMART Interconnect solutions, announced a working partnership with JEDA Technologies to deliver validated SystemC models of Sonics SMART Interconnect solutions. Sonics will utilize JEDA’s SystemC OCP Checker to validate the interoperability of SystemC models of Sonics SMART Interconnect solutions. Sonics will also provide JEDA with these SystemC models to support JEDA’s development and application engineering requirements. By providing each other with key design components, JEDA and Sonics are able to develop higher quality products.