iRobot, Boeing to Develop Small Unmanned Ground Vehicle Robot
iRobot Corp. (NASDAQ: IRBT) and The Boeing Company (NYSE: BA) announced they have signed a teaming agreement to develop and deliver a new, next-generation Small Unmanned Ground Vehicle (SUGV) to military, civil and commercial users. Weighing less than 30 pounds, the robot, named SUGV Early, will enable users to remotely conduct reconnaissance and secure real-time intelligence while remaining out of harm’s way. The companies will use Commercial Off-The-Shelf (COTS) technology to the greatest extent possible to rapidly produce and deploy the new robot, which is expected to be in production and ready for delivery in 2008.
Key Stream Reduces Power with at RTL with Sequence’s PowerTheater
Key Stream Corporation, designers of low-power wireless LAN chipsets, announced they are using Sequence Design’s PowerTheater to reduce power “when it counts,” early in the design cycle, at RTL.
Wintegra Rolls Out WinMax for Mobile WiMAX Basestations
Wintegra(TM), the fabless semiconductor company enabling the next generation of access networks, has announced the launch of WinMax, a family of single chip processors and associated software for WiMAX basestation (BTS) applications. The WinMax family provides an integrated silicon and software solution for the MAC (Media Access Control) and transport functions of mobile WiMAX basestations, and offers a common architecture that is scalable from cost-effective picostations up to multi-sector macro basestations supporting advanced features such as adaptive antenna system (AAS) and MIMO. The WinMAX family has market leading subscriber density, multiple sector support and available performance for rapidly evolving 802.16e WiMAX basestations.
IDT Introduces Advanced Memory Buffer Plus
IDT(TM) (Integrated Device Technology, Inc.)(NASDAQ: IDTI), a leading provider of vital semiconductor solutions, unveiled the third generation device in its Advanced Memory Buffer family, the Advanced Memory Buffer Plus (AMB+), which offers the lowest power consumption available in the industry today — up to forty percent power savings over competitive AMB offerings. Compliant with the JEDEC AMB specifications, the IDT AMB+ device is an essential building block in Fully Buffered Dual In-line Memory Modules (FB-DIMM) for high-performance, low-power computing platforms.
Cadence, IBM, Samsung, Chartered Announce 65nm CPF Reference Flow
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, announced immediate availability of the 65-nanometer Common Power Format (CPF) enabled reference flow targeting the Common Platform(TM) technology. This reference flow is the next step in the ongoing collaboration between Cadence(R) and the Common Platform coalition comprised of IBM, Chartered Semiconductor Manufacturing and Samsung.
Electronic Design Automation Interoperability Developers’ Forum
Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor design software, announced that its 19th electronic design automation (EDA) Interoperability Developers’ Forum will be held on Thursday, April 26th in Santa Clara, Calif. It will feature discussions about open analog standards, the Unified Power Format (UPF) and Liberty(TM) library advancements. The Forum provides an open environment for EDA tool developers, IC design engineers and IP providers to discuss the critical topic of interoperability. Anyone who wants to attend is welcome.
Best Buy Features HD Radio Products
Best Buy Co., Inc. has joined forces with the HD Digital Radio Alliance, a joint initiative of leading broadcasters to accelerate consumer adoption of HD Digital Radio, and iBiquity Digital Corporation, the developer of digital HD Radio(TM) technology, to now offer HD digital radio technology at all its 832 stores nationally. The HD Radio launch is supported by a marketing communications program that includes the latest phase of the Alliance’s previously announced $250 million radio campaign.
Arcom to Wear PC at Embedded Masterclass
Embedded computer manufacturer, Arcom, will be demonstrating their Zypad WL1000 wearable PC at the forthcoming embedded systems event, the Embedded Masterclass, 3rd May near Cambridge. The Zypad WL1000 packs the power of an industrial PC into a form that’s ergonomically designed and sized to fit an operator’s wrist.