News – 2007.04.23 – Early Edition

OKI Commercializes Ultraviolet Sensor IC
Oki Electric Industry Co., Ltd. (TOKYO:6703) announced it has commercialized an ultraviolet (UV) sensor IC that has an analog voltage output and does not require an optical cut filter. Samples of the ML 8511 will be available from June for use in portable UV meters.

Samsung Creates All-DRAM Stacked Memory with TSV Technology
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced that it has developed the first all-DRAM stacked memory package using ‘through silicon via’ (TSV) technology, which will soon result in memory packages that are faster, smaller and consume less power.

DSM Computer’s NanoServer Features with Core 2 Duo
DSM Computer’s newly developed 96M1558 embedded system from the “E6″ NanoServer family has been specially designed for high-end applications. The industry-standard server based on the high-performance Intel(R) Core(TM) 2 Duo (T7400) processor has a 2.16 clock rate. The two cores can use the 667 MHz front-side bus to access the shared system memory with a maximum capacity of 4 GB (DDR2 RAM).

DSM Computer Offers Intel Core 2 Duo Option
DSM Computer’s Infinity(R) “96M1594″ industrial computer available as ATX version tailored for high-end applications is now also available with the high-performance Intel(R) Core(TM) 2 Duo processor. The two cores use a 1066 MHz front-side bus to access the single/dual-channel main memory (DDR2 667 SDRAMs) with 4 GB as maximum memory capacity. The Intel(R) Graphic Media Accelerator 950 VGA integrated in the Intel(R) 945G chipset permits a high resolution of 2048 x 1536 pixels at 75 Hz refresh rate.

Agilent Creates New Automotive Electronics Test System
Agilent Technologies Inc. (NYSE:A) introduced an addition to its TS-5000 family of automotive electronics functional test systems: a system built to test all infotainment and telematic modules in cars. The Agilent TS-5030 supports recent trends of information and entertainment electronics integration into today’s automobiles, extending the TS-5000 family’s test capabilities beyond safety electronics and body control modules to infotainment electronics.

Concept Engineering Unveils Detailed Standard Parasitic Format Interface
Concept Engineering announced a new detailed standard parasitic format (DSPF) interface to the company’s SpiceVision(R) PRO and SGvision(R) PRO products that will enable design engineers to better understand, manage, and fix parasitic structures within complex digital, mixed-signal, and analog ICs.

Silicon Integration Initiative Releases ECSM 2.2 Specs
The Silicon Integration Initiative (Si2) released the Effective Current Source Modeling (ECSM) Version 2.2 specification, which includes extensions for modeling Signal Integrity. Building on the ECSM Timing and Power extensions previously released by the Si2 Open Modeling Coalition (OMC), the Signal Integrity (SI) extensions bring Noise modeling to the ECSM open modeling standard which now provides a complete and highly accurate modeling solution for sign-off analysis. With Timing, Noise, & Power modeling in the one standard format, IP providers will benefit from greater simplicity and efficiency in the library creation process as well as a simplified distribution model. Users will also benefit from the simplified flow setup and library management while supporting all of their sign-off modeling needs.

Agilent Reduces Endurance Test Time from Days to Hours
Agilent Technologies Inc. (NYSE:A) announced new hardware and software capabilities for its B1500A Semiconductor Device Analyzer and EasyEXPERT software test shell, which reduce the time required for the testing and characterization of advanced non-volatile memory (NVM) cells and other next-generation semiconductor devices.

Advanced Semiconductor Engineering Selects Cadence System-in-Package
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, and Advanced Semiconductor Engineering, Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, announced that ASE has selected Cadence(R) System-in-Package (SiP) design technology to provide high-performance package design services to its customers throughout the world.