Freescale Increases USB Options for Industrial Connectivity
Universal serial bus (USB), a mainstay in the consumer market, is rapidly emerging as a de facto communications standard within the industrial marketplace. Helping designers respond to this market opportunity, Freescale Semiconductor has expanded its 32-bit ColdFire(R) USB device portfolio to offer flexible USB connectivity for a wide range of industrial applications.
Fonix DECtalk TTS Enables Text-to-Speech for Epson Chip
Fonix Speech, Inc., a wholly owned subsidiary of Fonix Corporation (OTCBB: FNIX) specializing in embedded speech interfaces for mobile devices, handheld electronic products, video game systems and processors, announced Fonix text-to-speech (TTS) technology on a new semiconductor chip manufactured and sold by Seiko Epson Corporation (“Epson”), a worldwide provider of information-related equipment.
Mercury, NTT-AT to Develop Cell BE Processor Based AVC/H.264 Codec
Mercury Computer Systems, Inc. (NASDAQ: MRCY) announced its collaboration with NTT Advanced Technology Corporation (NTT-AT) to develop an image encoding engine based on the Cell Broadband Engine(TM) (BE) processor, at NAB2007, April 16-19 at the Las Vegas Convention Center in Las Vegas, Nevada. The engine is designed for AVC/H.264 (Advanced Video Coding), a codec standard suitable for archiving of high-definition (HD) images, with more than twice the compression capability of MPEG-2.
RapidIO Trade Association, Embedded Planet Offer Training
The RapidIO(R) Trade Association and Embedded Planet announced they have partnered to create a RapidIO Technology training curriculum that will provide hands-on training for designers employing RapidIO technology in high performance, innovative systems. Embedded Planet will leverage its years of professional training experience, first-hand knowledge of RapidIO design processes, and input from the RapidIO Trade Association members to develop and deliver a set of high quality training courses. RapidIO hardware and software training courses are scheduled to be available beginning in April 2007.
Sharp Debuts LCD for One-Seg-Compatible Mobile Phones
Sharp (TSE: 6753) has succeeded in developing a new LCD for mobile equipment such as mobile phones. The new LCD features the industry’s highest contrast ratio of 2,000:1, a wide viewing angle of 176 degrees that is top class in the industry, and a high-speed response time of 8 ms.
Concurrent to Release RedHawk Real-Time Linux 4.2
Concurrent (NASDAQ:CCUR), a leading provider of time-critical Linux(R) operating systems and integrated computer solutions for mission-critical applications, announced that it will be releasing this month a new version of its popular RedHawk(TM) Linux real-time operating system, RedHawk Linux 4.2.
Crossware Enhances ARM Debugger with Software Flash Memory Breakpoints
Crossware, a leading embedded software tools developer, has added software flash memory breakpoints to its ARM(R) Development Suite. This enhancement will enable an unlimited number of breakpoints to be set in flash memory resulting in faster debugging and reduced development timescales.
ADVANSUS Introduces VCN700-LIC10 VIA Mini-ITX Motherboard
Advansus, a joint-venture company of ASUS and Advantech, announces the first in a series of VIA C7 Mini-ITX motherboards. VCN700-LIC10 features a fanless solution integrated with an onboard ultra low power VIA C7 1.0 GHz processor and a CN700 digital media chipset. Along with high speed performance and rich functionality, VCN700-LIC10 provides a cost-effective solution for Point-of-Service (POS), KIOSK, thin client, digital signage, and medical applications.
Altera Announces TOPPERS-Pro RTOS for Nios II Embedded Processor
Altera Japan, Ltd. in conjunction with A.I. Corporation, an embedded software distributor and the TOPPERS Project, a nonprofit organization, announced the immediate availability of TOPPERS-Pro Multi/FDMP, a function-distributed real-time operating system (RTOS) that provides multiprocessor support for Altera’s Nios(R) II embedded processor, the world’s most widely used configurable soft-core processor. Targeted at a wide variety of applications in the digital consumer, office equipment and automotive markets, this embedded solution addresses the performance, power consumption and radio noise emission requirements of today’s advanced systems.
Emerson, Intel Promote PMBus Digital Power Management
Emerson Network Power, a business of Emerson (NYSE: EMR), and Intel Corporation (NASDAQ:INTC) are jointly promoting the benefits of the PMBus(TM) digital power management standard at the Intel Developer Forum in Beijing, where Intel is hosting a live public demonstration of a rack of servers configured with PMBus(TM) compliant ac-dc power supplies from Emerson Network Power.
TES to Market Rambus IP Solutions
Rambus Inc. (NASDAQ:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip architectures, and TES Electronic Solutions (TES), the global electronics design and manufacturing services company, announced a joint marketing agreement to deliver comprehensive and synergistic design solutions. The partnership expands the customer support for Rambus intellectual property (IP) through TES’ extensive network of worldwide design centers. Under the agreement, TES will market and integrate Rambus IP products as part of its IC and system designs.
Nallatech, Intel to Develop FSB FPGA Accelerator Modules, Design Tools
Nallatech, the leader in high-performance FPGA computing solutions, announced at the Intel Developers Forum that it has signed an agreement with Intel to develop socket-based accelerator modules which support the Intel(R) QuickAssist Technology accelerator strategy.
Intel CE 2110 Media Processor Powers Next Gen Devices
Intel Corporation unveiled a highly integrated media processor for the consumer electronics (CE) market segment that will power a new generation of devices, such as digital set top boxes and networked media players, and bring consumers advanced in-home information and entertainment services.
Xilinx Showcases FPGA-based Acceleration Module in China
Xilinx, Inc. (Nasdaq: XLNX) announced it will demonstrate the world’s highest performance FPGA-based acceleration module at the Intel Developer Forum China this week. The Xilinx Accelerated Computing Platform (ACP) targets Intel Front Side Bus (FSB)-FPGA accelerator modules and features an FSB-capable Virtex(TM)-5 FPGA module as a plug-in to an Intel(R) Xeon(R) CPU socket.
OSCI Releases SystemC Users Group Survey Data Trends Report
The Open SystemC(TM) Initiative (OSCI), an independent non-profit organization dedicated to supporting and advancing SystemC as an industry standard language for electronic system-level design, released a new report confirming worldwide adoption of SystemC is strong and continues to grow, and that SystemC user groups in all geographies are quickly adding members and taking an active role in promoting standardization efforts.
Lanner Announces VIA CN700 ITX Motherboard for HDTV Display
Lanner Electronics Inc, a global leader in applied computing hardware, announced the addition of the EM-9765 to its range of boards designed for intelligent display applications. This board is equipped with a VIA C7 or Eden processor, VGA, LVDS, HDTV, MPEG-2 decoder, audio and a host of storage, expansion and connectivity options, ideal for media streaming and display applications.
Tensilica’s Diamond SDK Supports Avnet LX60 FPGA Boards
Tensilica(R), Inc. announced that it is now supporting Avnet LX60 FPGA boards for high-speed hardware-based simulations of its Diamond Standard processor family. Software developers can use these popular, low cost FPGA boards, which allow Diamond Standard processor cores to run on Xilinx Virtex(TM)-4 FPGAs, to speed their software design, debug and program optimization processes.