New on Embedded Star – 2007.04.13

CSR BlueVOX-QFN Bluetooth Chip
CSR’s new BlueVOX-QFN chip reduces the cost of Bluetooth headsets. The new chip, together with all of the necessary components for a Bluetooth mono headset, will cost OEMs only $6 Bill of Materials (eBOM), meaning they can now produce Bluetooth headsets at a fraction of current costs. CSR’s BlueVOX-QFN is available now, and headsets using BlueVOX QFN are expected to be on the market by Spring 2007.

Agilent Signal Integrity Designer
Agilent’s Signal Integrity Designer features high-frequency SPICE simulation technology. The software suite, which is part of the Advanced Design System EDA software, provides high-speed digital board designers with accurate time-domain response. Agilent’s Advanced Design System EDA software offers a complete set of front-to-back simulation and layout tools and instrument links for RF and microwave IC design in a single, integrated design flow. Its signal integrity solution for high-speed digital design is made possible through its unique co-simulation technology. The software can model entire serial data links, including interconnects, pre-emphasis and adaptive equalization, in the presence of non-linear driver and receiver models.

Altova UModel 2007
UModel(R) 2007 is the latest release of Altova’s UML 2 software design tool. The new UModel release includes four additional diagram types that round out the product with the full complement of UML 2.1 diagrams. It also adds a unique capability to model XML Schema files in UML, plus support for reverse engineering of Java and C# binary files, and the ability to hyperlink elements of UML diagrams to other diagrams or external files.

Technobox Passive XMC-to-PCI Express Adapter
The Technobox 4821 passive XMC-to-PCI Express adapter allows a single XMC to be inserted into an 8x PCIe slot. All the lanes are fixed at 2.5 Gbps per lane in each direction. This adapter has been designed to minimize signal lengths on the 2.5GHz LVDS PCI Express bus. Four impedance-controlled signal layers and four power planes (2xGND, 3.3V, and V12) are employed to minimize transmission line effects. Two 64-pin headers are provided to permit access of various XMC signals from the P15 and P16 connectors.

ITOX COM Express Module
ITOX’s new G5C900-B-G COM Express supports Intel(R) dual-core processors. The module utilizes the Mobile Intel(R) 945GM Express chipset supported under Intel’s Embedded Architecture program, and accepts a wide performance-range of Intel mPGA 479 packaged processors. This includes the Intel(R) Core(TM) Duo processor featuring dual-core architecture, Intel(R) Core(TM) Solo processor, Intel(R) Celeron(R) M processor and Intel(R) Celeron(R) M ULV processor.

Actel CoreABC and Core8051s Controller Cores
Actel recently introduced the small, easy-to-use CoreABC and the configurable Core8051s. The controller cores complement the company’s existing library of industry-standard options, including a variety of ARM, 8051 and LEON processor solutions, optimized for Actel’s field-programmable gate arrays (FPGAs). In addition to third-party tools and capabilities, Actel also offers a comprehensive development environment, boards and reference designs to support its processor offerings. This ecosystem of tools and support enable Actel customers to get system-level products to market quickly and reduce cost and risk.