News – 2007.04.11 – Early Edition

Renesas Selects GDA for PCI Express to AMBA AXI Bridge
GDA Technologies, Inc., a fast growing supplier of Intellectual Property (IP) and Electronic Design Services (EDS), announced that Renesas Technology Corp., a leading semiconductor company, has selected GDA for development of a PCIE 2 AMBA AXI Bridge to be used in a SOC design for consumer applications.

NTT DoCoMo Adopts RADVISION’s ProLab 3G-324M Test Solution
RADVISION (Nasdaq: RVSN), a leading provider of video network infrastructure and developer tools for unified visual communications over IP, 3G, and emerging next-generation IMS networks, announced that its ProLab 3G-324M Test Solution was purchased by NTT DoCoMo.

Freescale Ships Over 100 Million Automotive Microcontrollers Annually
Freescale Semiconductor, the leading supplier of semiconductors to the automotive industry, is now shipping its popular S12 16-bit automotive microcontrollers (MCUs) at a rate of more than 100 million units a year. The company achieved this volume shipment milestone while maintaining an exceptionally low defect rate of less than one part per million. And, the pace of S12 product shipments continues to grow significantly in 2007.

Multimedia over Coax Alliance Selects National Technical Systems
National Technical Systems Inc. (Nasdaq:NTSC) (NTS), a leading provider of quality, conformance and certification testing, quality registration and managed services, announced that it has been selected by the Multimedia over Coax Alliance (MoCA(TM)) as the exclusive lab to perform certifications for MoCA products.

ASEKey Crypto Supports Microsoft Windows Smart Card Framework
Athena Smartcard Solutions announced that its ASEKey Crypto smart card token successfully completed the Microsoft certification program for smart card minidrivers. Minidrivers are essentially “device drivers” for smart cards as implemented in the Windows Smart Card Framework. Vendors which build such minidrivers may choose to have theirs certified by Microsoft, ensuring, for the first time, that smart cards that are certified provide the best compatibility experience for Windows customers.

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Si2 Offers Common Power Format Workshop at DATE
Silicon Integration Initiative (Si2) announced a Common Power Format Workshop to be held at DATE in Nice, France on Wednesday, April 18, 10 a.m.-12 p.m., Acropolis Room – MAIA. Low-power requirements are a primary concern for IC design. They affect all electronic systems. In addition to portable battery-operated devices other electronic products are experiencing pressure to reduce power consumption, such as computers in data centers where the enormous energy use is becoming a major global concern. The Common Power Format (CPF) specification holistically captures low-power design intent so that it can be used to consistently communicate low-power intent throughout the IC design flow.

Semiconductor Industry Sees Balanced Growth
After moving through computer and communications-driven phases, the global semiconductor industry has been experiencing relatively balanced growth over the past few years, a condition that is expected to continue, reports In-Stat. This does not mean that all segments will experience the same growth every year, the high-tech market research firm says. But all segments will track the overall industry growth closely enough that none will come to be seen as the industry driver or anchor.

Calypto PowerPro CG Supports Common Power Format
Calypto(TM) Design Systems Inc., the leader in sequential analysis technology, announced that its newly introduced PowerPro(TM) CG product that reduces power at the register transfer level (RTL) will support Si2′s Common Power Format 1.0 (CPF).

Cypress PSoC Designer IDE Supports Windows Vista
Cypress Semiconductor Corp. (NYSE:CY) announced that its popular PSoC Designer(TM) Integrated Development Environment (IDE) now supports PCs running Microsoft’s new Vista(TM) operating system. PSoC Designer Release 4.4 also integrates new “user modules” for Cypress’s industry leading CapSense capacitive sensing solution, SD Cards, and USB-UARTs. It includes all previous releases and service packs, enabling designers to download a single file over the Internet worldwide.

MSC Vertriebs COM Express-Platform CXE Features Dual Channel Memory
MSC Vertriebs GmbH has increased the graphic performance of their COM Express-Platform CXE even more through the support of the Dual Channel memory technology. The main memory on the COM Express module CXE-CD945 can be expanded up to a maximum capacity of 4 GB by inserting 2 equivalent sized DDR2 SDRAMs in both 200 pin SO-DIMM sockets. This makes the board especially suitable for high-end industrial applications, such as for use in image processing and medical systems, as well as for game applications.

Tundra Appoints New CTO and VP of Operations
Tundra Semiconductor Corporation (TSX:TUN), the world leader in System Interconnect, has appointed Dr. Benny Chang to the position of Chief Technology Officer (CTO), and promoted Mr. Ed Vopni to Vice President of Operations. Dr. Chang and Mr. Vopni bring technology innovation, market-driven focus, and momentum to Tundra’s smart interconnect solutions strategy.