EDA News – 2007.03.21

ST, Infra-Com Unveil Wireless Digital Audio Reference Design
STMicroelectronics (NYSE: STM), a world leader in digital audio ICs, and Infra-Com Ltd., a world leader in short range diffused infrared (DIR(TM)) wireless communication ICs, announced a complete reference design for a high-bit-rate wireless audio solution intended for consumer electronic products such as home theater systems, surround-sound and gaming speakers, DTV speakers, as well as portable music and aftermarket accessories. The “Drum” and “Violin” designs combine Infra-Com’s receiver side IrGate(TM) IC with the all-digital class D power amplifier and signal processor from ST’s Sound Terminal family, creating a complete high-quality remote audio amplification system.

Power Architecture Developer Conference Seeking Papers
Design engineers are invited to submit proposals around technology innovations and practical design information for the first-ever vendor-neutral Power Architecture(TM) Developer Conference, to be held in Austin, Texas, September 24 – 25, 2007.

Barric Sponsors Excellence in Electronics Award
UK electronics manufacturer, Barric, has announced that they will sponsor a prize for excellence in electronics. The prize is to be awarded annually to the most accomplished student studying electronics at the City College in Norwich.

TestQuest Opens Mobile Device and Handset Testing Office in Beijing
TestQuest, Inc., the leader in test automation and management solutions for mobile devices and applications, announced that it has opened an office in Beijing, China. The new office is in response to China’s significant growth in the handset development and manufacturing area as well as its exploding wireless market.

NXP, TI, Sony Claim Top Spots in Contactless IC Vendor Ranking
NXP Semiconductors has been ranked at the top of a new Contactless IC Vendor Matrix released by ABI Research. Texas Instruments and Sony Corporation claimed the second and third spots in the company’s most recent evaluation of IC vendors serving the contactless payments market worldwide. The Vendor Matrix is an analytical tool developed by ABI Research to provide a clear understanding of vendors’ positions in specific markets.

Texas Instruments Creates Universal Industrial Output Driver
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced a precision voltage-to-current converter/transmitter designed for standard 0-20mA and 4-20mA analog signals, as well as 5-25mA signals and voltage outputs. The XTR111 can deliver current up to 36mA and boasts output error detection and output disable. This new device, from the company’s Burr-Brown product line, features low supply current of 500uA, low drift span of 5ppm/C and a wide 7V to 44V supply range. The XTR111 is easy to use and adaptable to many applications such as analog current output for industrial process control and three-wire sensor systems.

BlueNote Networks Selects RADVISION SIP Server Platform
RADVISION (Nasdaq: RVSN), a leading provider of video network infrastructure and developer tools for unified visual communications over IP, 3G, and emerging next-generation IMS networks, announced that its SIP Server Platform and Advanced RTP Toolkit was embedded in BlueNote Network’s Service Oriented Architecture (SOA) IP telephony products.