Jetstream Introduces Three New IP Cores
Jetstream Media Technologies announced the availability of three IP cores: modular exponentiation accelerator, ultra fast XTS IP, and ultra-fast dual-mode JetCombo-2 IP.
E28 Adopts D2 vPort Embedded VoIP Engine for FMC Smart Phones
D2 Technologies, the market leader in embedded software platforms that power IP communications, announced that its vPort embedded VoIP engine software has been adopted by E28 Limited, a leader of open source Fixed Mobile Convergence (FMC) device solutions, for a new line of dual-mode FMC smart phones. These handsets combine GSM/GPRS cellular technology with the latest VoWLAN technology to make FMC a reality. D2 will be demonstrating this commercial implementation of a dual-mode phone at Spring VON (March 19 – 21).
Rambus Receives Partial Stay from FTC
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies, announced that the Federal Trade Commission (FTC) has stayed portions of its remedy order In the Matter of Rambus Inc. The stay is effective upon Rambus’ filing of a timely petition for review in a court of appeals. Rambus plans to appeal both the FTC’s liability and remedy orders in their entirety.
LaCie Selects TI 1394, USB Technology for d2 Extreme Hard Drives
Texas Instruments Incorporated (TI) (NYSE: TXN) announced that LaCie has selected TI’s 1394/FireWire and USB technology for its d2 Extreme Hard Drive Series including the d2, Big and Bigger Disks, and the Biggest FW800 4-drawer RAID.
Huawei Enhances 3G Products with RADVISION Mobile Video Technology
RADVISION(R) (Nasdaq: RVSN), a leading provider of voice and video network infrastructure and developer tools for unified visual communications over IP, 3G, and emerging next-generation networks, announced that Huawei Technologies, a leader in providing next generation telecommunications network solutions for operators around the world, has selected the RADVISION SCOPIATM 3G Gateway, 3G Video Communication Solutions and Interactive Video Platform, to enhance their 3G products and solution offerings.
D2, NXP Offer Integrated VoWLAN WiFi Phone Solution
D2 Technologies, the market leader in embedded software platforms that power IP communications, announced the availability of its vPort MP embedded VoIP software for NXP’s ARM9-based LPC3180 microcontrollers, allowing OEMs to rapidly deploy new VoWLAN WiFi phone handsets. D2, which offers the broadest ecosystem of VoIP software/SoC integrations, will be demonstrating this latest addition in the company’s suite at Spring VON (March 19 – 21). The demo also includes NXP’s WLAN module, BGW 211, Bluetooth module, BGB 203 and power management, PCF50685.
QuickLogic Targets Mobile Devices with ArcticLink Platform
QuickLogic(R) Corporation (NASDAQ:QUIK), the lowest power programmable solutions leader, announced an integrated programmable connectivity solution platform targeting mobile devices. The revolutionary ArcticLink(TM) solution platform reduces design time and risk by embedding high performance controllers, a programmable fabric for implementing additional controllers and peripheral connectivity, as well as a selectable processor interface – all in a single, small form factor low power device.
Semiconductor Equipment Sales Grow 23% to $40.47 Billion
SEMI, the global industry association of companies that supply manufacturing technology and materials to the world’s chip makers, reported that worldwide sales of semiconductor manufacturing equipment totaled $40.47 billion in 2006, representing a year-over-year increase of 23 percent. The data is available in the Worldwide Semiconductor Equipment Market Statistics (SEMS) Report, now available from SEMI.
Samsung, TI Team for High-Definition Audio-Video Network Alliance
Texas Instruments Incorporated (TI) [NYSE: TXN] announced that Samsung, a global leader in digital media and digital convergence technologies, is implementing TI’s 1394 technology for High-Definition Audio-Video Network Alliance (HANA) home entertainment networking products such as set-top-boxes (STB), digital televisions, TV nodes and digital video recorders (DVRs).
D2 vPort IPP Embedded VoIP Supports ELAN’s EM7A8620 ARM920 Processor
D2 Technologies, the market leader in embedded software platforms that power IP communications, announced the availability of its vPort IPP embedded VoIP software for ELAN’s EM7A8620 VoIP processor (integrated System-on-a-Chip microprocessor), allowing OEMs to rapidly deploy new VoIP IP phone handsets. D2, which offers the broadest ecosystem of VoIP software/SoC integrations, will be demonstrating this latest addition in the company’s suite at Spring VON (March 19 – 21).
Symbian Selects Azimuth AzCert Wi-Fi Certification Test Suite
Azimuth Systems, Inc., the leading provider of Wi-Fi engineering test equipment, announced that Symbian, the company that develops and licenses Symbian OS(TM), the market leading operating system for smartphones, has selected the AzCert(TM) Wi-Fi Certification Test Suite for Test Engine-enabled devices to help streamline performance, interoperability and certification testing of Symbian smartphones.
GIPS Ports VoiceEngine Embedded Software to ADI Blackfin Processors
Analog Devices, Inc. (NYSE: ADI) announced that Global IP Solutions (GIPS) has ported and optimized its VoiceEngine Embedded software application for the ADI Blackfin(R) family of processors. GIPS’ VoiceEngine Embedded is designed for use in CPU-based VoIP equipment such as hardware residential gateways and IP phones, and has been used by a number of key players in the VoIP market including Nortel, Skype, WebEx, Yahoo! and AOL. ADI’s Blackfin is a 16/32-bit embedded processor that blends microcontroller (MCU) and digital signal processing (DSP) capabilities in one integrated chip.
Sensor Platforms Debuts SSP-1401 Multi-Channel LRC Sensor Interface Chip
Sensor Platforms, a leader in IC-based sensor interface solutions, announced the introduction of the SSP1401 Multi-Channel LRC Sensor Interface chip. The SSP1401 provides a low-cost and user configurable design solution to applications requiring the interfacing of single or multiple sensors of various signal types and functionalities including resistive, capacitive, inductive, piezoelectric and pulse-count based sensor elements.