TimeSys Embedded Linux Development Webinars Expand
TimeSys Corporation, the leading developer service provider for the embedded Linux market, is adding more sessions to its popular series of educational webinars for embedded Linux developers. Running through March and April, the new topics cover best practices for embedded Linux development through an examination of project risk and the benefits of a common toolset. Later sessions in the series look at technology choices for developers building devices with a graphical interface and an in-depth look at the QEMU processor emulator.
Aeroflex Adds New Features to ATE Systems
At NEPCON 2007 (Hall 1, Stand M50), Aeroflex will launch a range of new capabilities and enhancements for its 5800 multi-configuration, multi-function test system, 4550 flying probe test system and 4250 advanced manufacturing test system. The Aeroflex 5800 multi-configuration, multi-function ATE system will be enhanced with a new digital functional test capability targeting digital functional test applications, mixed signal testing and in-system device programming. The new digital system is based on a Digital Test Controller board and up to 18 Digital Testpoint boards giving a maximum digital functional testpoint count of 1152 un-multiplexed I/O channels.
Motorola Makes Investment in AMIMON, Wireless HD Video
Motorola, Inc. (NYSE: MOT) through Motorola Ventures, its strategic venture capital arm, announced that it has made an equity investment in AMIMON, Inc., an emerging leader in semiconductor technology for wireless transmission of high-definition (HD) video. Terms of the investment were not disclosed.
Synopsys Hercules Physical Verification Supports IBM 65nm Designs
Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor design software, announced the availability of advanced device parameter measurement functionality in its Hercules(TM) Physical Verification Suite (PVS). Developed to support the latest release of 65-nanometer (nm) design kits from IBM (NYSE: IBM), this new functionality enables IBM foundry customers using the Hercules layout versus schematic (LVS) rule files in the kit to easily and accurately correlate device behavior to the IBM process.
Texas Instruments Shrinks PCI Express Bridge Device
Texas Instruments Incorporated (TI) (NYSE: TXN) announced a new package size for the XIO2000A, its industry-leading PCI Express to PCI Bus translation bridge device targeting PCI Express Mini Cards and ExpressCards for the mobile computing market where board space is at a premium.
TeleSoft CompactSIP Enables VoIP on Windows Mobile Devices
TeleSoft International introduced a CompactSIP SDK pre-ported to Windows Mobile 5.0 with which chip makers and phone manufacturers can quickly add standards-based VoIP to wireless devices, and to mobile and wired phones. TeleSoft will feature the Compact SIP SDK at its booth, 3443, during CTIA Wireless 2007, March 27-29, in Orlando, FL.
Tendril Network Operating Solution to Integrate with TI ZigBee Platform
Tendril, the leader in software for building, deploying and managing ZigBee(TM) applications, has expanded its collaboration with Texas Instruments Incorporated (TI) to accelerate customer deployments of ZigBee applications on TI’s ZigBee 2006 Compliant Platform. Through this partnership, TI will initially include information about Tendril’s Network Operating Platform(TM) software in its developer kits. In the future, Tendril’s software will be fully integrated with TI’s ZigBee(TM) platform.
Xilinx Offers System Monitor for Virtex-5 FPGAs
Xilinx, Inc. (NASDAQ: XLNX), the world’s leading supplier of programmable solutions, announced immediate availability of the System Monitor feature on all its Virtex(TM)-5 platform FPGAs. Already on-board all Xilinx Virtex-5 devices, the solution provides customers with the industry’s first analog debug and system management tool for thermal management and measurement of on-chip power supply voltages.
Altera Announces CEI-6G-LR/SR-Compliant Stratix II GX FPGAs
Altera Corporation (Nasdaq: ALTR) has successfully completed characterization of its Stratix(R) II GX FPGA family for the Optical Internetworking Forums (OIFs) Common Electrical Interface 6 Gbps Long Reach and Short Reach (CEI-6G-LR/SR) specifications, the company announced. Meeting this rigorous protocol exemplifies the robustness of the Stratix II GX transceivers and their ability to deliver 127 Gbits of aggregate bandwidth for high-speed chip-to-chip and backplane applications.
Mentor Debuts Nucleus USB Device Firmware Upgrade Class Driver
Mentor Graphics Corporation (NASDAQ:MENT) announced a new class driver for the Nucleus(R) USB software, supporting the Nucleus Operating System (OS). The Nucleus USB Device Firmware Upgrade (DFU) class driver allows embedded developers to utilize Universal Serial Bus (USB) to enable consumers to upgrade and improve embedded software on existing devices.