Broadcom Debuts Mobile TV Cellular Handset Platform
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, announced the availability of a new mobile television reference design platform that will be demonstrated at this week’s 3GSM World Congress. Broadcom’s new mobile TV platform is a tremendous technological advancement for manufacturers that plan to integrate mobile TV into their handset designs in a cost-effective manner. The new Broadcom(R) platform includes integrated mobile TV software and a reference application that can be customized specifically for each manufacturer’s handset design, enabling product differentiation that will help drive the widespread acceptance of high quality mobile television.
Atmel Combines Microcontroller, LIN System Basis into Multichip Module
Atmel(R) Corporation (Nasdaq: ATML), a global leader in the development and fabrication of advanced semiconductor solutions, announced the availability of the ATA6602 and ATA6603 multichip modules, extending Atmel’s current broad IC family for LIN applications. These new devices are designed for automotive actuator applications typically found in comfort electronics (e.g., window lifter, mirror or seat adjuster) as well as in powertrain applications. Due to their very small size, the ATA6602 and ATA6603 are also ideal for sensor node applications such as control panels, air quality, rain/sun sensors and many more.
Freescale Creates S08 Microcontrollers with Integrated LCD Driver
Freescale Semiconductor has introduced a family of highly integrated, power-efficient 8-bit microcontroller (MCU) devices optimized for one of the electronics industry’s most pervasive display technologies: liquid crystal displays (LCDs). The MC9S08LC60 (LC60) family features Freescale’s first S08-based flash MCUs to include an integrated LCD driver module with an internal charge pump.
Billion Plus Wi-Fi Chipsets to Ship in 2012
During 2006, the Wi-Fi semiconductor market shipped just under 200 million Wi-Fi chipsets, and reached over 500 million chipset shipments cumulatively, according to the latest release of ABI Research’s quarterly “Wi-Fi IC Market Share Analysis and Forecasts” database.
Hitachi, Renesas Develop 1.5V 512kb Memory Module
In addressing the need for next-generation high-density on-chip non-volatile memory technology, Hitachi, Ltd. and Renesas Technology Corp. announced the development of a 512-kbyte (4-Mbit equivalent) phase change memory module operating at a 1.5-V power supply voltage, which achieves 416-kbyte/sec high-speed write and read speeds with a 20-nanosecond(1) access time. Using the previously developed “low-power phase change memory cells” with a 100-uA (micro(2)-ampere) write current, the two companies developed a peripheral circuit technology to enable the high-speed write and read operations.
DATE 07 Electronic Systems Design Conference
The advance programme for DATE 07 is now available in print and online. DATE combines the world’s favourite electronic systems design conference and Europe’s leading international exhibition for electronic design, automation and test, from system level hardware and software implementation right down to integrated circuit design.
New Form Factors Drive Mezzanine Card Market
The global market for merchant mezzanine/daughter cards will grow 13.3% annually through 2010 off the strength of several new form factors, according to VDC’s recently released volume of its Merchant Computer Boards for Embedded/Real-Time Applications (MCBREA), 14th Edition. The report indicates that global 2005 sales of mezzanine cards and carriers were US$ 355.7 million and projected to grow over 87% by 2010 reaching US$ 667 million.
Elma Introduces New AdvancedTCA Handle
Elma Electronic Inc., a global manufacturer of electronic packaging products, has announced an AdvancedTCA handle that solves the most persistent problems and complaints of ATCA handles in the market.