TI Wins Patent Case Against MEC
Texas Instruments Incorporated (NYSE: TXN) said that the United States District Court in the Central District of California granted a summary judgment in favor of TI, dismissing a patent infringement case filed by Microprocessor Enhancement Corporation (MEC), a subsidiary of Acacia Research Corporation.
DSPCon Appoints Two New Executives
DSPCon, Inc., a leading, global supplier of high-performance, dynamic data acquisition, analysis and archiving systems and services for high-value military, aerospace and rotating machinery applications, has appointed two new senior executives to its corporate management team, led by president and chief executive officer Alfred N. Brower. John Thoma has been appointed director of business development and Anthony Mongelli has been named corporate controller. Mr. Thoma and Mr. Mongelli will report directly to Mr. Brower. The appointments are effective immediately.
TI Rolls Out Ultra-low Power MSP430FG461x MCUs
Bringing high integration and ultra low power to complex, deeply embedded industrial sensing applications including portable medical systems, Texas Instruments Incorporated (TI) (NYSE:TXN) announced volume availability of the MSP430FG461x series of ultra-low power MCUs with up to 120KB flash memory.
Synopsys Designware IP Supports NXP PXPIPE PHY Interface
Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor design software, announced that its DesignWare(R) intellectual property (IP) for PCI Express(R) supports the PXPIPE PHY interface standard from NXP, the independent semiconductor company founded by Philips. Designers using the DesignWare IP for PCI Express in their System-on-Chip (SoC) designs with an external PHY now have an option to choose a proven, version 1.1-compliant solution based on either the PIPE PHY interface or NXP PXPIPE PHY interface standard. Using an external PHY chip such as the NXP PX1011A provides designers an alternative PHY solution for ASIC prototyping and ASIC/FPGA-based products.
Digi JumpStart Kits Support Windows Embedded CE 6.0 on ARM
Digi International (NASDAQ – DGII) announced that Digi is the first company to offer a development kit with board support package (BSP) for Microsoft’s recently released Windows Embedded CE version 6.0 for ARM processors and integrated wireless networking. BSPs are now available for Digi’s ARM-based ConnectCore(TM) 9C and ConnectCore Wi-9C modules, with integrated wired and wireless networking support, as part of Digi’s new range of development kits – Digi JumpStart Kits(TM) (JSK).
Synopsys Gen II IP Achieves PCI Express 2.0 Compliance
Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor design software, announced that its DesignWare(R) PHY and digital controller intellectual property (IP) for PCI Express(TM) 2.0 (Gen II) is the first complete Gen II IP solution from a single vendor to pass the latest compliance testing at the PCI-Special Interest Group (PCI-SIG) workshop. Compliance helps ensure interoperability while minimizing risk and reducing time to market for designers using complex, high-performance PCI Express interfaces. Designers depend on the market-leading DesignWare PHY, digital cores and verification IP to provide a complete, silicon-proven solution for incorporating PCI Express connectivity into system-on-chip (SoC) designs.
Synplicity Synthesis Supports Xilinx Virtex-5 SXT FPGA
Synplicity, Inc. (Nasdaq:SYNP), a leading supplier of software for the design and verification of semiconductors, announced its industry-leading synthesis software and true DSP synthesis software solutions provide immediate and comprehensive design support for Xilinx (Nasdaq:XLNX) Virtex-5 SXT FPGAs – the latest member of its 65nm Virtex-5 FPGA family optimized for high-performance Digital Signal Processing (DSP).
EDA Forecast and Industry Vision Panel Features CoWare CEO
CoWare(R), Inc., the leading supplier of platform-driven electronic system-level (ESL) design software and services, announced that it’s CEO, Alan Naumann will participate in a panel discussion entitled “CEO Forecast and Industry Vision” at the EDA Consortium’s annual forecast meeting on February 22, 2007 in Santa Clara, Calif.
EDA Consortium Annual CEO Forecast and Industry Vision
The Electronic Design Automation (EDA) Consortium is sponsoring its annual CEO Forecast and Industry Vision panel. During this major industry event, five CEOs will discuss trends affecting the EDA industry and offer insights on growth for the upcoming year.
Embedded Systems Academy Extends MicroCANopen
ESAcademy(R) has extended MicroCANopen, the family of low-cost and highly optimized CANopen software protocol stacks, by adding the option to auto-create the configuration for the stack using the visual editor for Electronic Datasheet (EDS) files, CANopen Architect EDS.