Inside the iPhone

Posted by Ken Cheung in Wireless on Tuesday, February 13, 2007

Chipworks
Chipworks compiled a list of components used in the Apple iPhone. It's just speculation so take it for what it's worth.

  • Baseband processor: Infineon – S-Gold3/ARM926?
  • Applications/video processor: Samsung/ARM10 or 11
  • 802.11 chip: Marvell/ARM9?
  • Touchscreen controller: Broadcom
  • Touchscreen: Balda/TPK
  • Bluetooth: CSR
  • USB IC: Alcor, Phison
  • Audio: Wolfson
  • Memory module: A-Data, Transcend
  • Flash memory: Samsung, Toshiba, Hynix
  • Position sensor (MEMS?): STMicroelectronics, Analog devices?
  • Light sensor: ???
  • Proximity sensor: ???
  • Camera sensor: Micron?
  • Camera module: Altus or Lite-On Technology, Primax Electronics
  • Camera lens: Largan Precision
  • Microphone: ???
  • Power management: NXP?
  • Passives: Cyntec
  • Quartz: TXC
  • Assembly: Foxconn, FIH
  • Casing & mechanical parts: Foxconn & Catcher
  • Push button: Sunrex
  • Connectors & cable: Entery, Cheng Uei, Foxlink, Advanced Connectek
  • PCB: Unimicron & Tripod

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