EDA News – 2007.01.29

Synopsys to Directly License IBM Embedded Microprocessor Cores
Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor design software, announced that it has signed an agreement with IBM that enables Synopsys to sub-license IBM’s PowerPC(R) 440 and 405 embedded microprocessor cores and associated peripheral cores directly to customers. As a newly authorized Power Architecture(TM) Design Center, Synopsys now offers sub-licenses that include the right for customers to manufacture system-on-chip (SoC) designs incorporating PowerPC cores at any foundry of their choosing. Synopsys now offers the IBM cores through its DesignWare(R) Star IP Program.

Encirq Offers Free DeviceSQL Quick Start Suite for Device Data Management
Encirq Corporation, the global leader in device data management and the creator of DeviceSQL(TM), announced the immediate availability of the DeviceSQL Quick Start Suite, a freely downloadable version of DeviceSQL coupled with an interactive, on-line tutorial to help embedded software engineers learn and use more efficient, best practice-based approaches for managing data in their device software applications.

Agilent, Xilinx Unveil High-Speed Serial I/O Link Test Solution
Agilent Technologies Inc. (NYSE:A) and Xilinx Inc. (NASDAQ:XLNX) announced a collaborative solution for testing and optimizing high-speed serial links implemented with Xilinx RocketIO multi-gigabit transceivers (MGTs). The new tool, the Agilent E5910A serial link optimizer, combines Agilent measurement and analysis software with Xilinx intellectual property and JTAG communication infrastructure.

Actel Introduces Two Free Controller Cores for Embedded Systems
Delivering on its strategy to support embedded systems designers with a comprehensive portfolio of processor solutions, Actel Corporation (Nasdaq: ACTL) introduced two free controller cores; the small, easy-to-use CoreABC and the configurable Core8051s. These cores complement the company’s existing library of industry-standard options, including a variety of ARM, 8051 and LEON processor solutions, optimized for Actel’s field-programmable gate arrays (FPGAs). In addition to third-party tools and capabilities, Actel also offers a comprehensive development environment, boards and reference designs to support its processor offerings. This ecosystem of tools and support enable Actel customers to get system-level products to market quickly and reduce cost and risk.

Altera, National Semi, MorethanIP Debut IEEE 1588 Timing Control Board
Designers of next-generation industrial control and automation systems challenged by requirements of the IEEE 1588 standard for precision clock synchronization can now accelerate their connectivity designs with the first 8-port switch development board. The board provides key features essential to end products by combining devices and intellectual property (IP) from Altera Corporation (NASDAQ: ALTR), National Semiconductor Corporation (NYSE:NSM) and Germany-based design and IP provider MorethanIP (MTIP).

Xilinx Unveils ChipScope Pro 9.1i Software and Serial I/O Toolkit
Xilinx, Inc. (Nasdaq: XLNX) announced the immediate availability of its ChipScope(TM) Pro 9.1i software and ChipScope Serial I/O Toolkit 9.1i — the latest version of the company’s unique solution for on-chip FPGA verification. The 9.1i version leverages the advanced 65nm ExpressFabric(TM) architecture of the Virtex(TM)-5 platform family, supporting up to 60 percent faster clock speeds as compared to the previous 90nm FPGA version. New support in the ChipScope Pro Serial I/O toolkit extends the dramatic reduction in cost and complexity of debugging high-speed serial I/O designs in Virtex-5 LXT FPGAs. Devices from both the LX and LXT platforms of the Virtex-5 family are shipping now.

Motorola, TI Team on High-Volume 3G, WiMAX, OMAP for Mobile Devices
Motorola, Inc. (NYSE:MOT), a global leader in mobile communications and seamless mobility solutions, and Texas Instruments Incorporated (TI) (NYSE:TI), a global leader in silicon solutions for wireless communications, announced that the companies are expanding their strategic relationship to include 3G, WiMAX and OMAP(TM) technologies in the design and development of new, experience-optimized mobile devices. The expanded relationship covers current, emerging and next-generation wireless standards and leverages intellectual property from both Motorola and TI.

Virage Logic Rolls Out NOVeA Embedded Non-Volatile Memory
To support the low cost and high performance requirements of today’s consumer and secure applications, Virage Logic (NASDAQ:VIRL), the semiconductor industry’s trusted IP partner and pioneer in Silicon Aware IP(TM), introduced its next generation embedded non-volatile product — NOVeA.

TI Six-Channel Power Management IC Targets Portable Electronics
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced a family of six-channel power management integrated circuits (PMICs) for single-cell, lithium-powered portable electronics. Combining high-performance power building blocks in a single 4 mm x 4 mm package, the easy-to-design devices support power system requirements of advanced application processors used in smart phones, portable media players, navigation systems and other electronics.

CoWare Virtual Platform Becomes Finalist for DesignVision Award
CoWare(R), Inc., the leading supplier of platform-driven electronic system-level (ESL) design software and services, announced that its Virtual Platform Product Family has been nominated as a finalist in the prestigious International Engineering Consortium’s (IEC) DesignVision Awards program. IEC created this program to honor technologies, applications, products, and services judged to be the most unique and beneficial to the industry.

Cadence Low-Power Solution Leverages Si2 Common Power Format
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced the Cadence(R) Low-Power Solution, the industry’s first fully integrated flow for logic design, verification, and implementation of low-power chips. The Cadence Low-Power Solution integrates leading-edge design, verification, and implementation technology with the Common Power Format (CPF), an Si2 format for specifying power-saving techniques early in the design process, to deliver an end-to-end low-power design solution to IC engineers. By preserving low-power design intent throughout the design, the solution eliminates laborious manual work, reduces power-related chip failure, and provides power predictability early in the design process.

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