- NVIDIA Selects Magma Physical Verification Tools for 65nm GPUs
Magma(R) Design Automation Inc. (Nasdaq: LAVA), a provider of semiconductor design software, announced that NVIDIA has adopted Magma’s Quartz(TM) DRC, Quartz LVS and Quartz DRC Litho physical verification tools. NVIDIA selected this qualified flow to improve manufacturability and time to market for 65-nanometer (nm) graphics processing units (GPUs).
- Cortina and Xilinx Make 40Gbps Interlaken Connection
Cortina Systems(R) (Cortina) and Xilinx, Inc. (Nasdaq:XLNX) announced successful interoperability of the Virtex(TM)-5 FPGA and Cortina’s new CS3477 Ethernet MAC aggregation IC, via the Interlaken protocol. Interlaken, an open specification for high-speed chip-to-chip packet transfers using the latest serial technology, enables component manufactures to scale their devices to 40 Gbps and beyond.
- OSCI Receives Synopsys Virtual Platform Technology for SystemC TLM 2.0
Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor and system level design software, announced that it has contributed key technology to the Open SystemC Initiative (OSCI), an independent not-for-profit organization dedicated to supporting and advancing SystemC as an open source standard for system-level design. The contribution addresses the need for a high-performance interface standard to enable the development of Virtual Platforms based on SystemC.
- Calibre YieldAnalyzer Sets DFM Flow Standard for STARC
Mentor Graphics Corporation (Nasdaq: MENT) announced that STARC (Semiconductor Technology Academic Research Center), a research consortium co-founded by eleven major Japanese semiconductor companies, will standardize on Calibre(R) YieldAnalyzer(TM) for critical area analysis in their DFM flow.
- ATEME Adds Dolby Digital AC-3 Pass-through to MPEG-4 AVC Encoder
ATEME, a leading provider of MPEG-4 AVC / H.264 live encoders and storage encoders, adds Dolby Digital AC-3 pass-through to its integrated MPEG-4 AVC/H.264 Professional Software Encoder. AC-3 Stereo or 5.1 multichannel audio is hence associated to best-in-class video quality, to deliver the best consumer experience.
- Accent Licenses ARM Processors for New Designs
Accent S.p.A, the global electronic design realisation solutions provider, has announced that it has entered into a technology licensing agreement with ARM [(LSE: ARM; Nasdaq: ARMHY)] for the ARM7TMI-S(TM), the ARM926EJ-S(TM) and the ARM1136J-S(TM) synthesisable processors, as well as a range of PrimeCell(R) peripherals and Physical IP technology. The agreement will see Accent focus on the use of ARM(R) processors for all new design projects realised for fabless and chipless IC customers requiring a core licence through Accent.
- Concurrent Introduces VME/VXS Open Standards SBC with Intel Core 2 Duo
Concurrent Technologies announces the release of an Intel(R) Core(TM) 2 Duo processor based VME/VXS single board computer (SBC) as a performance upgrade from the VX 405/04x released earlier in the year. The VX 407/04x uses the latest mobile dual core processor from the Intel(R) embedded roadmap, the 2.16 GHz Intel Core 2 Duo T7400 processor, giving an even greater improvement in measured performance/watt. The VX 407/04x can access up to 4 Gbytes DDR2-667 soldered SDRAM at up to 10.6 Gbytes/s.
- SDC Systems to Launch ASIC, FPGA Design Acceleration Tools at AAE
At the forthcoming AAE-07, automotive electronics event, SDC Systems will be announcing the UK launch of a range of ASIC and FPGA Design Acceleration Tools. The AAE-2007 (Advanced Automotive Electronics Show)is to be held at the Heritage Motor Centre in Gaydon on January 31st and SDC Systems will be exhibiting a range of leading edge embedded development tools and software.
- Concurrent Introduces Dual PMC Carrier Board for VME Applications
Concurrent Technologies announces the release of their next generation of dual PMC Carrier Board for VME based applications. The AD CR3/PMC, a non-intelligent dual PMC carrier board, is designed to provide extra PMC sites to enable standard and custom I/O requirements to be implemented using industry standard PMC modules in VME systems. The AD CR3/PMC enables system I/O, graphics, data processing and network interfaces to be added to the existing functionality of a range of Concurrent Technologies’ VME Single Board Computers (SBC). Extended temperature options are available.
- Renesas Takes Advantage of Cadence Encounter RTL Compiler
Cadence Design Systems, Inc. (NASDAQ: CDNS), announced that Renesas Technology Corp. has adopted Cadence(R) Encounter(R) RTL Compiler with advanced global synthesis, a key technology of the Encounter digital IC design platform, in its ASIC design kits and methodologies for 90 nanometers and below. Renesas is extending their current ASIC kits and methodologies to add support for Encounter RTL Compiler.
- Concurrent Unveils 24-ports, VITA 41.3 Switched Serial Fabric Board
Concurrent Technologies announces their new VXS packet switched serial fabric board, the FX 210/018, to operate alongside their range of VMEbus VXS packet switched single board computers. The FX 210/018 is an “unmanaged” embedded 1000Mbps baseband IEEE 802.3 switching platform, conforming to VITA 41.3, providing a low cost, low power, packet switching solution for voice/data communications.
- AMD Introduces AMD64 Longevity Program for Embedded Solutions
AMD (NYSE: AMD) announced that its AMD64 Longevity Program for embedded solutions, which provides processor availability for five years, has expanded to include two additional low-power processors based on AMD’s successful mobile products. The addition of the Mobile AMD Sempron(TM) processor model 3500+ and the AMD Turion(TM) 64 X2 dual-core mobile technology Model TL-52 to the AMD64 Longevity Program means embedded designers will have more options to innovate at the system-level, and the opportunity to deliver leading edge performance with low cost of ownership to their customers.
- IBASE Rolls Out ET900 COM Express CPU Module with Intel Core 2 Duo
IBASE, a leading embedded computing manufacturer, announces the ET900, a low power COM Express CPU module using the Mobile Intel(R) 945GM Express chipset and the latest Intel(R) Core(TM)2 Duo processors. With an extremely small form factor, the ET900 offers the flexibility and high levels of processing performance needed for industrial automation, test & measurement, medical imaging, digital signage and automotive applications.