- Fujitsu Fingerprint Touch Sensor Integrates with Mobio Biometric Device
Fujitsu Microelectronics America, Inc. (FMA), an industry leader in fingerprint sensor technology, announced that its MBF200 single-touch sensor IC has been integrated into Mobio(R), a handheld biometric security device developed by Cryptolex Trust Systems, Inc.
- Fujitsu to Showcase H.264 Video-Processing IC for HD Recording, Playback
Fujitsu Microelectronics America, Inc. (FMA) will host a demonstration of Amedia Networks’ new gateways, which use Fujitsu’s MPEG-2 encoder and decoder technology with Amedia’s wireless chip set to transmit bandwidth-intensive HD video wirelessly at distances up to 75 meters at the annual International Consumer Electronics Show in Las Vegas January 8-11, Sands Hotel, booth 70809.
- Samsung First to Sample 50nm 16Gb NAND Flash Memory
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced that it is now sampling its 16-gigabit (Gb) NAND flash memory with customers – the first NAND flash using 50 nanometer (nm) process technology.
- Arrow Electronics Acquires Agilysys KeyLink Systems Group
Arrow Electronics, Inc. (NYSE:ARW) announced that it has signed a definitive agreement pursuant to which Arrow will acquire substantially all of the assets and operations of the Agilysys KeyLink Systems Group (“KeyLink”), a leading enterprise computing solutions distributor, for $485 million in cash. Arrow will also enter into a long-term procurement agreement with the Agilysys Enterprise Solutions Group, Agilysys’ value-added reseller business.
- Toshiba Selects Silicon Optix HQV Video Processor for HD DVD Player
Silicon Optix, the leader in programmable video processors, announced that its Reon-VX HQV video processor will be featured in Toshiba’s new top-of-the-line HD DVD player, the HD-XA2.
- Agilent Debuts Microwave Test Accessories for Communications, Mil-Aero
Agilent Technologies Inc. (NYSE:A) introduced a series of first-to-market, broadband microwave test accessories specifically optimized for communications and aerospace/defense applications. The innovations embedded in this industry-leading series provide broadband capability and enhanced measurement accuracy, which significantly expand the test and measurement capabilities in the communications and aerospace/defense industries.
- Telelogic Offers Free Modeler for UML 2.1 Modeling
Telelogic (Nordic Exchange/MidCap/TLOG), the leading provider of software solutions that align advanced systems and software development with business objectives, announced the release of Telelogic Modeler(TM), a free Unified Modeling Language(TM) (UML(TM)) design environment for engineers, designers, and developers of embedded, real-time, and enterprise IT applications. The free Telelogic Modeler substantially increases the opportunity for organizations to start to increase productivity and shorten design cycles with Model-Driven Development.
- Lattice Semiconductor Rolls Out ispLEVER 6.1 Service Pack 1
Lattice Semiconductor (NASDAQ: LSCC) announced the immediate release of its latest ispLEVER(R) design tool suite update, version 6.1 Service Pack 1. This release includes expanded support for the recently announced LatticeECP2M(TM) FPGA family, including the LatticeECP2M20 and LatticeECP2M35 devices. LatticeECP2M FPGAs are the industry’s only low-cost FPGAs with massive on-board memory and integrated 3.125 Gbps SERDES. This release also includes the latest OEM versions of Mentor Graphics’ Precision RTL and Synplicity’s Synplify synthesis design tools, part of Lattice’s complete FPGA design solutions.