EDA Blog - electronic design automation, embedded systems, ic

News – 2006.12.20 – Early Edition

• LeCroy Equips Microchip Training Centers with WaveJet Oscilloscopes
  Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller and analog semiconductors, and LeCroy Corporation (NASDAQ: LCRY), a worldwide leader in serial data test solutions, announced that the companies have established an ongoing joint collaboration for LeCroy to provide Microchip Technology workshop participants with access to semiconductor test equipment.
• NA Semiconductor Equipment Industry Posts Book-to-Bill Ratio of 0.97
  North American-based manufacturers of semiconductor equipment posted $1.45 billion in orders in November 2006 (three-month average basis) and a book-to-bill ratio of 0.97 according to the November 2006 Book-to-Bill Report published today by SEMI. A book-to-bill of 0.97 means that $97 worth of orders were received for every $100 of product billed for the month.
• Wipro Partners with Tensilica Processor Core Design Center
  Wipro Technologies, the global IT Services arm of Wipro Limited (NYSE:WIT), is Tensilica’s newest processor core design center partner. As a Tensilica(R) design center and Tensilica Xtensions(TM) Network partner, Wipro will combine its extensive intellectual property (IP) portfolio, systems knowledge, architecture modeling and verification expertise with system-on-chip (SOC) design services for customers using Tensilica’s Xtensa(R) configurable processors or Diamond Standard processor cores.
• NEC Unveils 3.5-Inch High-Definition System-on-Glass LCD Module
  NEC Electronics America, Inc., a leading supplier of innovative liquid crystal display (LCD) solutions in the Americas, announced the successful development by NEC LCD Technologies of a 3.5-inch (8.9 centimeters diagonal) system-on-glass (SOG) LCD module whose quarter high-definition (QHD) array of 960 x 540 pixels enables the reproduction of images in resolutions over 300 pixels per inch (ppi). Integration of semiconductor systems on the glass substrate contributes to the module’s small size, while technology based on low-temperature polysilicon (LTPS) rather than amorphous silicon contributes to the module’s narrow frame.

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