EDA News – 2006.12.11

  • STARC Selects Synopsys Design Compiler for STARCAD-CEL Methodology
    Synopsys, Inc. (Nasdaq: SNPS), a world leader in semiconductor design software, announced that the Semiconductor Technology Academic Research Center (STARC) has deployed Synopsys Design Compiler(R) topographical technology in its 65-nanometer (nm) Synopsys Galaxy(TM) Design Platform-based design flow (project name: Eagle Flow) in the STARCAD(R)-CEL methodology.
  • IMEC Demonstrates Copper Contact Potential for (sub-)32nm Node
    At today’s IEEE International Electron Devices Meeting, IMEC presents the potential of copper contact technology for the (sub-)32nm node which has clear advantages for performance and power consumption. Using the proper copper contact barriers will be key to guarantee reliability and yield of the CMOS front-end.
  • IMEC Showcases High-Performance Germanium (Ge) pMOS Device
    At today’s IEEE International Electron Devices Meeting, IMEC presents high-performance germanium (Ge) pMOS devices using a silicon (Si) compatible process flow. The hole mobility obtained in these devices is up to 2.7 times higher than the universal hole mobility for silicon. This result is obtained without using enhancement techniques such as strain. Record drain currents were also achieved for Ge devices with the shortest gate length ever reported.
  • IMEC Demonstrates Laser Anneal for 32nm Node
    At today’s IEEE International Electron Devices Meeting, IMEC reports that laser anneal is a promising option for further transistor scaling to the 32nm node. By device demonstration, IMEC shows that laser anneal allows to scale junction depth without degradation of series resistance and overlap capacitance.
  • IMEC Shows Potential of 3D-Stacked IC Integration
    At today’s IEEE International Electron Devices Meeting, IMEC shows potential of 3D integration using standard front-end techniques for via fabrication. Extremely thinned bulk-silicon die containing through silicon vias are stacked and interconnected by direct Cu-to-Cu thermo-compression bonding.
  • VMETRO Ships Virtex-5 LX FPGA-based PCI/PCI-X and PMC Products
    VMETRO demonstrated its leadership by shipping its first Virtex(TM)-5 LX FPGA based PCI/PCI-X and PMC board-level products. Illustrating VMETRO’s commitment to provide innovative computing solutions for use from development to deployment, these high-performance reconfigurable computing solutions merge the best in performance, innovation and reliability. These products are well suited for Virtex-5 FPGA evaluation and development as well as use in deployed signal processing systems in diverse markets and applications; from telecommunications infrastructure to defense and signal intelligence.
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  • BFO, Hallmark, Venspro Make Christmas Interactive
    Big Faceless Organization (BFO), provider of high quality Java software components, are excited to add Venspro, Holland’s leading Marketing and PR Consultancy, to their enviable client base.
  • RTI Becomes Principal Partner in Sun Partner Advantage Program for ISV
    Real-Time Innovations (RTI), The Real-Time Middleware Company, announced that it has been named a Principal Partner in the Sun Partner Advantage Program for Independent Software Vendors (ISVs). RTI qualified for this designation by meeting Sun Microsystems’ stringent criteria for excellence as a supplier of high-performance messaging solutions and by committing to tight strategic and technical alignment with Sun.
  • CoWare Virtual Platform Interoperable with Windows Embedded CE
    CoWare(R), Inc., the leading supplier of platform-driven electronic system-level (ESL) design software and services, announced the CoWare Virtual Platform product family is now interoperable with the Windows Embedded CE operating system. As a result, companies developing Windows Embedded CE-based electronics devices can start their software development before physical hardware is available, which results in lower cost product development and faster time-to-market.
  • IBM, Macronix, Qimonda Demonstrate New Memory Chip Technology
    Scientists from IBM, Macronix and Qimonda announced joint research results that give a major boost to a new type of computer memory with the potential to be the successor to flash memory chips, which are widely used in computers and consumer electronics like digital cameras and portable music players.